Heatsink
Jump to navigation
Jump to search
Overview[edit | edit source]
This page is currently work-in-progress. (November 2023)
A/A+ chassis heatsink[edit | edit source]
B/B' chassis heatsink[edit | edit source]
- On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- This heatsink is unique in that it also cools the DSP via an additional thermal pad. DSP is not cooled in most chassis.
- Has a heatpipe
C/C' chassis heatsink[edit | edit source]
- On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- Has no heatpipe, but larger fin area (compared to B/B' chassis)
AB-chassis heatsink[edit | edit source]
D/D' chassis heatsink[edit | edit source]
- On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
F-chassis heatsink (type 1, large aluminum fins)[edit | edit source]
F-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)[edit | edit source]
G-chassis heatsink (type 1, large aluminum fins)[edit | edit source]
G-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)[edit | edit source]
H-chassis heatsink[edit | edit source]
I-chassis heatsink[edit | edit source]
J-chassis heatsink[edit | edit source]
K-chassis heatsink (separate EE and GS)[edit | edit source]
K-chassis heatsink (combined EE+GS)[edit | edit source]
L-chassis heatsink (separate EE and GS)[edit | edit source]
L-chassis heatsink (combined EE+GS)[edit | edit source]
M-chassis heatsink[edit | edit source]
N-chassis heatsink[edit | edit source]
P-chassis heatsink[edit | edit source]
R-chassis heatsink (large shield type)[edit | edit source]
Goes with the GH-071 board
R-chassis heatsink (small shield type)[edit | edit source]
Goes with the GH-072 board
Also used in the Sony BRAVIA KDL22PX300