KLMAG2GE4A-A001: Difference between revisions

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Line 40: Line 40:
| - || A-G 1-14 || - || NP or NC || not present or not connected
| - || A-G 1-14 || - || NP or NC || not present or not connected
|-
|-
| || H3 || DAT0 || I/O || Data I/O : Bidirectional channel used for data transfer
| B4 || H3 || DAT0 || I/O || Data I/O : Bidirectional channel used for data transfer
|-
|-
| || H4 || DAT1 || I/O || Data I/O : Bidirectional channel used for data transfer
| B5 || H4 || DAT1 || I/O || Data I/O : Bidirectional channel used for data transfer
|-
|-
| || H5 || DAT2 || I/O || Data I/O : Bidirectional channel used for data transfer
| B6 || H5 || DAT2 || I/O || Data I/O : Bidirectional channel used for data transfer
|-
|-
| || J2 || DAT3 || I/O || Data I/O : Bidirectional channel used for data transfer
| B2 || J2 || DAT3 || I/O || Data I/O : Bidirectional channel used for data transfer
|-
|-
| || J3 || DAT4 || I/O || Data I/O : Bidirectional channel used for data transfer
| B3 || J3 || DAT4 || I/O || Data I/O : Bidirectional channel used for data transfer
|-
|-
| || J4 || DAT5 || I/O || Data I/O : Bidirectional channel used for data transfer
| B1 || J4 || DAT5 || I/O || Data I/O : Bidirectional channel used for data transfer
|-
|-
| || J5 || DAT6 || I/O || Data I/O : Bidirectional channel used for data transfer
| B7 || J5 || DAT6 || I/O || Data I/O : Bidirectional channel used for data transfer
|-
|-
| || J6 || DAT7 || I/O || Data I/O : Bidirectional channel used for data transfer
| B8 || J6 || DAT7 || I/O || Data I/O : Bidirectional channel used for data transfer
|-
|-
|  || K2 || VDDi ||  || Internal power node. Connect 0.1uF capacitor from VDDi to ground.
|  || K2 || VDDi ||  || Internal power node. Connect 0.1uF capacitor from VDDi to ground.

Revision as of 02:47, 15 February 2013



Samsung KLMAG2GE4A-A001

Samsung KLMAG2GE4A-A001

Pads when no eMMC present

Used in 'Super Slim 12GB' CECH-4003A MPX-001 accompanied by Panasonic MN66840

Partnumber: KLMAG2GE4A-A00x
Density:    16GB
Controller: VHX
Package: 169-ball BGA
Package type: 2 chip (DDP)
Package size: 12mm x 16mm
MMC version: eMMC4.41
Class: Class400
Organisation: x8
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

http://www.samsung.com/global/business/semiconductor/product/flash-emmc/overview

Handy PDFs:

See also : http://www.vitadevwiki.com/index.php?title=Media








Testpoints eMMC

eMMC-BGA169
eMMC
Testpoint
Pad # Name Type Description
- A-G 1-14 - NP or NC not present or not connected
B4 H3 DAT0 I/O Data I/O : Bidirectional channel used for data transfer
B5 H4 DAT1 I/O Data I/O : Bidirectional channel used for data transfer
B6 H5 DAT2 I/O Data I/O : Bidirectional channel used for data transfer
B2 J2 DAT3 I/O Data I/O : Bidirectional channel used for data transfer
B3 J3 DAT4 I/O Data I/O : Bidirectional channel used for data transfer
B1 J4 DAT5 I/O Data I/O : Bidirectional channel used for data transfer
B7 J5 DAT6 I/O Data I/O : Bidirectional channel used for data transfer
B8 J6 DAT7 I/O Data I/O : Bidirectional channel used for data transfer
K2 VDDi Internal power node. Connect 0.1uF capacitor from VDDi to ground.
K4 VSSQ Ground Memory controller core and MMC IF ground connection
K6 VSSQ Supply Memory controller core and MMC IF I/O power supply
M6 VCC Supply Flash I/O and memory power supply
M7 VSS Ground Flash I/O and memory ground connection
N5 VCC Supply Flash I/O and memory power supply
P5 VSS Ground Flash I/O and memory ground connection
R10 VSS Ground Flash I/O and memory ground connection
T10 VCC Supply Flash I/O and memory power supply
U5 RESET Hardware Reset
U8 VSS Ground Flash I/O and memory ground connection
U9 VCC Supply Flash I/O and memory power supply
W4 VCCQ Supply Memory controller core and MMC IF I/O power supply
W5 CMD I/O Command: A bidirectional channel used for device initialisation and command transfers
W6 CLK Input Clock: Each cycle directs a 1-bit transfer on the command and DAT lines
Y2 VSSQ Ground Memory controller core and MMC IF ground connection
Y4 VCCQ Supply Memory controller core and MMC IF I/O power supply
Y5 VSSQ Ground Memory controller core and MMC IF ground connection
AA3 VCCQ Supply Memory controller core and MMC IF I/O power supply
AA4 VSSQ Ground Memory controller core and MMC IF ground connection
AA5 VCCQ Supply Memory controller core and MMC IF I/O power supply
AA6 VSSQ Ground Memory controller core and MMC IF ground connection
AB-HG 1-14 - NP or NC not present or not connected

remark: the following Pad #letter's are not used: I, O, Q, S, X, Z, AI, AO, AQ, AS, AX, AZ


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