KLMAG2GE4A-A001: Difference between revisions
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=== Testpoints eMMC === | === Testpoints eMMC === | ||
<div style="float:right">[[File:EMMC-BGA169.png|200px|thumb|left|eMMC-BGA169]]<br />[[File:EMMC - colormapping - front.jpg|200px|thumb|left| | <div style="float:right">[[File:EMMC-BGA169.png|200px|thumb|left|eMMC-BGA169]]<br />[[File:EMMC - colormapping - front.jpg|200px|thumb|left|eMMC - colormapping - front]]<br />[[File:EMMC - colormapping - back.jpg|200px|thumb|left|eMMC - colormapping - back]]</div> | ||
<div style="height:650px; overflow:auto"> | <div style="height:650px; overflow:auto"> | ||
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Revision as of 19:46, 15 February 2013
Samsung KLMAG2GE4A-A001
Used in 'Super Slim 12GB' CECH-4003A MPX-001 accompanied by Panasonic MN66840
Partnumber: KLMAG2GE4A-A00x Density: 16GB Controller: VHX Package: 169-ball BGA Package type: 2 chip (DDP) Package size: 12mm x 16mm MMC version: eMMC4.41 Class: Class400 Organisation: x8 Voltage : 1.7 - 1.95V / 2.7 - 3.6V
http://www.samsung.com/global/business/semiconductor/product/flash-emmc/overview
Handy PDFs:
- Embedded MMC (eMMC) Standard MMCA 4.4 (JESD84-A44)(March 2009)
- iNAND_e_MMC_4_41_IF_data_sheet_v1_0.pdf
- JESD84-A44.pdf
- Victor_Tsai.pdf
- WBNR_FTF10_NET_F0598_PDF.pdf
See also : http://www.vitadevwiki.com/index.php?title=Media
Testpoints eMMC
| Color | eMMC Testpoint |
Pad # | Name | Type | Description |
|---|---|---|---|---|---|
| - | A-G 1-14 | - | NP or NC | not present or not connected | |
| B4 | H3 | DAT0 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B5 | H4 | DAT1 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B6 | H5 | DAT2 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B2 | J2 | DAT3 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B3 | J3 | DAT4 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B1 | J4 | DAT5 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B7 | J5 | DAT6 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B8 | J6 | DAT7 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| K2 | VDDi | Internal power node. Connect 0.1uF capacitor from VDDi to ground. | |||
| K4 | VSSQ | Ground | Memory controller core and MMC IF ground connection | ||
| K6 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply | ||
| M6 | VCC | Supply | Flash I/O and memory power supply | ||
| M7 | VSS | Ground | Flash I/O and memory ground connection | ||
| N5 | VCC | Supply | Flash I/O and memory power supply | ||
| P5 | VSS | Ground | Flash I/O and memory ground connection | ||
| R10 | VSS | Ground | Flash I/O and memory ground connection | ||
| T10 | VCC | Supply | Flash I/O and memory power supply | ||
| - | U5 | RESET | Hardware Reset | ||
| U8 | VSS | Ground | Flash I/O and memory ground connection | ||
| U9 | VCC | Supply | Flash I/O and memory power supply | ||
| W4 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply | ||
| W5 | CMD | I/O | Command: A bidirectional channel used for device initialisation and command transfers | ||
| W6 | CLK | Input | Clock: Each cycle directs a 1-bit transfer on the command and DAT lines | ||
| Y2 | VSSQ | Ground | Memory controller core and MMC IF ground connection | ||
| Y4 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply | ||
| Y5 | VSSQ | Ground | Memory controller core and MMC IF ground connection | ||
| AA3 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply | ||
| AA4 | VSSQ | Ground | Memory controller core and MMC IF ground connection | ||
| AA5 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply | ||
| AA6 | VSSQ | Ground | Memory controller core and MMC IF ground connection | ||
| AB-HG 1-14 | - | NP or NC | not present or not connected |
remark: the following Pad #letter's are not used: I, O, Q, S, X, Z, AI, AO, AQ, AS, AX, AZ