KLMAG2GE4A-A001: Difference between revisions

From PS3 Developer wiki
Jump to navigation Jump to search
mNo edit summary
(Greengrocers comma removal)
(18 intermediate revisions by 3 users not shown)
Line 1: Line 1:
[[Category:Hardware]]
== Samsung [[KLMAG2GE4A-A001]] ==
== Samsung [[KLMAG2GE4A-A001]] ==
<div style="float:right">[[File:Samsung KLMAG2GE4A-A001.jpg|200px|thumb|left|Samsung KLMAG2GE4A-A001]]<br />[[File:Superslim missing component close to SB.jpg|200px|thumb|left|Pads when no eMMC present]]</div>
<div style="float:right">[[File:Samsung KLMAG2GE4A-A001.jpg|200px|thumb|left|Samsung KLMAG2GE4A-A001]]<br />[[File:Superslim missing component close to SB.jpg|200px|thumb|left|Pads when no eMMC present]]</div>
Line 15: Line 13:
  Organisation: x8
  Organisation: x8
  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
variants:
* in [http://wiiubrew.org/wiki/EMMC_NAND Wii-U consoles]: Samsung KLM8G2FE3B-B001 (8GB class100 BGA153) or KLMBG4GE4A-A001 (32GB class400 BGA169)
* in [http://desmond.imageshack.us/Himg96/scaled.php?server=96&filename=img0889kf.jpg&res=landing Xbox 360 consoles]: Samsung KLM4G1HE3F-B001 (4GB class50 BGA153)
* in [http://www.techinsights.com/teardowns/sony-playstation-vita-teardown/ PSVita PCH-1000]: Toshiba [http://download.siliconexpert.com/pdfs/2010/12/11/22/49/47/571/tos_/manual/thgbm3g5d1fbaie32nm4gbe-mmc_e_rev0.3_100917.pdf THGBM3G5D1FBAIE]
* in [http://www.4gamer.net/games/990/G999021/20131013001/ PSVita PCH-2000]: Toshiba THGBMAG5A1JBAIR
* in other PSVita PCH-2000: Sandisk {{unk|?}}
* in [http://www.ifixit.com/Teardown/PlayStation+Vita+Teardown/7872 other PSVita] [http://yifan.lu/2013/12/18/removing-the-cpu-and-nand-from-psvita/#more-670 PCH-1000] and [http://www.4gamer.net/games/990/G999021/20131115043/ VitaTV]: Samsung KLM4G1FE3A-F001
* in [http://www.konsolen-junkies.de/images/one_nand1.jpg Xbox-one]: SK Hynix H26M42003GMR 8GB eMMC NAND Flash
* in [http://3dbrew.org/wiki/Hardware#NAND_pinout 3DS]: Toshiba THGBM2G3P1FBAI8 1GB eMMC NAND flash


http://www.samsung.com/global/business/semiconductor/product/flash-emmc/overview
http://www.samsung.com/global/business/semiconductor/product/flash-emmc/overview


=== Handy PDF's ===
=== Handy PDFs ===
* [http://www.jedec.org/sites/default/files/docs/JESD84-A44.pdf Embedded MMC (eMMC) Standard MMCA 4.4 (JESD84-A44)(March 2009)]<br />
* [http://www.jedec.org/sites/default/files/docs/JESD84-A44.pdf Embedded MMC (eMMC) Standard MMCA 4.4 (JESD84-A44)(March 2009)]<br />
* [http://omapworld.com/iNAND_e_MMC_4_41_IF_data_sheet_v1_0%5B1%5D.pdf iNAND_e_MMC_4_41_IF_data_sheet_v1_0.pdf]
* [http://omapworld.com/iNAND_e_MMC_4_41_IF_data_sheet_v1_0%5B1%5D.pdf iNAND_e_MMC_4_41_IF_data_sheet_v1_0.pdf]
Line 31: Line 39:


=== Testpoints eMMC ===
=== Testpoints eMMC ===
<div style="float:right">[[File:EMMC-BGA169.png|200px|thumb|left|eMMC-BGA169]]<br />[[File:EMMC - colormapping - front.jpg|200px|thumb|left|eMMC - colormapping - front]]<br />[[File:EMMC - colormapping - back.jpg|200px|thumb|left|eMMC - colormapping - back]]<br />[[File:MMC-13pads-layout.png|200px|thumb|left|MMC-plus 13pad layout]]<br />[[File:MMC-SD-miniSD-microSD-Color-Numbers-Names.jpg|200px|thumb|left|MMC, SD, miniSD, microSD cards pinout]]<br />[[File:EMMC Wii-U.jpg|200px|thumb|left|eMMC in Wii-U]]</div>
<div style="float:right">[[File:EMMC-BGA169.png|200px|thumb|left|eMMC-BGA169]]<br />[[File:EMMC - colormapping - front.jpg|200px|thumb|left|eMMC - colormapping - front]]<br />[[File:EMMC - colormapping - back.jpg|200px|thumb|left|eMMC - colormapping - back]]<br />[[File:MMC-13pads-layout.png|200px|thumb|left|MMC-plus 13pad layout]]<br />[[File:MMC-SD-miniSD-microSD-Color-Numbers-Names.jpg|200px|thumb|left|MMC, SD, miniSD, microSD cards pinout]]<br />[[File:EMMC Wii-U.jpg|200px|thumb|left|eMMC in Wii-U - pinout]]<br />[[File:EMMC Wii-U-removed.jpg|200px|thumb|left|eMMC in Wii-U removed (as you can see, only 4-bit mode is used)]]</div>


{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable sortable" style="border:1px solid #999; border-collapse: collapse;"  
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable sortable" style="border:1px solid #999; border-collapse: collapse;"  
Line 73: Line 81:
| style="color:white; background-color:#FF0000;" | &nbsp; ||  || T10 || 04 || 04 || 04 || 04 || 04 || VCC || Supply || Flash I/O and memory power supply
| style="color:white; background-color:#FF0000;" | &nbsp; ||  || T10 || 04 || 04 || 04 || 04 || 04 || VCC || Supply || Flash I/O and memory power supply
|-
|-
| - || - || U5 || - || - || - || - || - || RESET || Input || Hardware Reset (not connected on PS3)
| - || - || U5 || - || - || - || - || - || RESET || Input || Hardware Reset (not connected on PS3 and Wii-U)
|-
|-
| style="color:white; background-color:#C0C0C0;" | &nbsp; ||  || U8 || 03 / 06 || 03 / 06 || 03 / 06 || 03 / 06 || 06 || VSS || Ground || Flash I/O and memory ground connection
| style="color:white; background-color:#C0C0C0;" | &nbsp; ||  || U8 || 03 / 06 || 03 / 06 || 03 / 06 || 03 / 06 || 06 || VSS || Ground || Flash I/O and memory ground connection
Line 106: Line 114:
'''Note:''' for hooking up to SD card reader the following might be needed:
'''Note:''' for hooking up to SD card reader the following might be needed:
* 50K nominal (10K - 90K range) Ohm pullup between VCC and DAT3/CD for card detect (see also [http://www.nxp.com/documents/application_note/AN10911.pdf Application Notes 10911])
* 50K nominal (10K - 90K range) Ohm pullup between VCC and DAT3/CD for card detect (see also [http://www.nxp.com/documents/application_note/AN10911.pdf Application Notes 10911])
=== Connecting to reader ===
<GALLERY>
File:Fake SDcard - example 1.jpg|Fake SDcard - example 1
File:Fake SDcard - example 2.jpg|Fake SDcard - example 2
</GALLERY>




{{Console}}


[[Category:Flash]]
{{Motherboard Components}}<noinclude>[[Category:Main]]</noinclude>

Revision as of 13:27, 18 June 2017

Samsung KLMAG2GE4A-A001

Samsung KLMAG2GE4A-A001

Pads when no eMMC present

Used in 'Super Slim 12GB' CECH-4003A MPX-001 accompanied by Panasonic MN66840

Partnumber: KLMAG2GE4A-A00x
Density:    16GB
Controller: VHX
Package: 169-ball BGA
Package type: 2 chip (DDP)
Package size: 12mm x 16mm
MMC version: eMMC4.41
Class: Class400
Organisation: x8
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

variants:

http://www.samsung.com/global/business/semiconductor/product/flash-emmc/overview

Handy PDFs

See also :

Testpoints eMMC

eMMC-BGA169

eMMC - colormapping - front

eMMC - colormapping - back

MMC-plus 13pad layout

MMC, SD, miniSD, microSD cards pinout

eMMC in Wii-U - pinout

eMMC in Wii-U removed (as you can see, only 4-bit mode is used)
Color eMMC
Testpoint
BGA169
Pad #
MMC-plus
(1-,4-,8-bit)
Pad #
MMC
(1bit)
Pad #
SD
(1-,4-bit)
Pad #
miniSD
(1-,4-bit)
Pad #
microSD
(1-,4-bit)
Pad #
Name Type Description
- - A-G 1-14 - - - - - NP or NC - not present or not connected
  B4 H3 07 07 07 07 07 DATA0 I/O Data I/O : Bidirectional channel used for data transfer
  B5 H4 08 - 08 08 08 DATA1 I/O Data I/O : Bidirectional channel used for data transfer
  B6 H5 09 - 09 09 01 DATA2 I/O Data I/O : Bidirectional channel used for data transfer
  B2 J2 01 01 (NC) 01 01 02 DATA3 I/O Data I/O : Bidirectional channel used for data transfer
  B3 J3 10 - - - - DATA4 I/O Data I/O : Bidirectional channel used for data transfer
  B1 J4 11 - - - - DATA5 I/O Data I/O : Bidirectional channel used for data transfer
  B7 J5 12 - - - - DATA6 I/O Data I/O : Bidirectional channel used for data transfer
  B8 J6 13 - - - - DATA7 I/O Data I/O : Bidirectional channel used for data transfer
  K2 04 04 04 04 04 VDDi Supply Internal power node. Connect 0.1uF capacitor from VDDi to ground.
  K4 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
  K6 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
  M6 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
  M7 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
  N5 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
  P5 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
  R10 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
  T10 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
- - U5 - - - - - RESET Input Hardware Reset (not connected on PS3 and Wii-U)
  U8 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
  U9 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
  W4 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
  W5 02 02 02 02 03 CMD I/O Command: A bidirectional channel used for device initialisation and command transfers
  W6 05 05 05 05 05 CLK Input Clock: Each cycle directs a 1-bit transfer on the command and DAT lines
  Y2 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
  Y4 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
  Y5 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
  AA3 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
  AA4 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
  AA5 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
  AA6 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
- - AB-HG 1-14 - - - - - NP or NC - not present or not connected

remark: the following Pad #letter's are not used: I, O, Q, S, X, Z, AI, AO, AQ, AS, AX, AZ

Note: for hooking up to SD card reader the following might be needed:

  • 50K nominal (10K - 90K range) Ohm pullup between VCC and DAT3/CD for card detect (see also Application Notes 10911)

Connecting to reader