Wireless: Difference between revisions

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Subboard is BGA soldered with 9x7 grid, with some pads not present. <br />
Subboard is BGA soldered with 9x7 grid, with some pads not present. <br />
See also : https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=2022208
See also : "(Short term Confidential)Internal Photo_RF" @ [https://apps.fcc.gov/oetcf/eas/reports/ViewExhibitReport.cfm?mode=Exhibits&RequestTimeout=500&calledFromFrame=Y&application_id=549060&fcc_id=AK8CUH100C1 AK8CUH100C1 filing]




{{Motherboard Components}}
{{Motherboard Components}}
<noinclude>[[Category:Main]]</noinclude>
<noinclude>[[Category:Main]]</noinclude>

Revision as of 18:07, 21 May 2014

Bluetooth+Wifi

Subboard is BGA soldered with 9x7 grid, with some pads not present.
See also : "(Short term Confidential)Internal Photo_RF" @ AK8CUH100C1 filing