Thermal: Difference between revisions

@@ Line 1: / Line 1: @@
 == Overview ==
-The PS2 has a thermal sensor IC in proximity to the EE (or EE+GS, depending on the revision).
-On consoles with a Dragon [[MechaCon]] (SCPH-5XXXX and later), the thermal sensor is connected to the MechaCon and the temperature can be read from software. On earlier consoles, the thermal sensor is connected to the [[SysCon]] and the temperature can (currently) not be read from software.
-== LM56 ==
-Used on GH-001 and GH-003. (What about GH-008?)
-== LM74 ==
-Used on GH-004, GH-005, GH-006, GH-007, GH-010, GH-012, GH-013, GH-014
-(What about GH-008?)
-== LM70 ==
-Used on GH-015, GH-016, GH-017, GH-019, GH-022
-== LM71 ==
-Used on GH-023, GH-026, GH-029, GH-035
-== PS2 hardware in PS3 ==
-[https://www.psdevwiki.com/ps3/COK-00x COK-001] has unpopulated pads for a thermal sensor next to EE+GS. COK-002 doesn't have any temperature monitoring capabilities next to GS.

Revision as of 21:50, 26 January 2023