Heatsink
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Overview
This page is currently work-in-progress. (November 2023)
A/A+ chassis heatsink
B/B' chassis heatsink
- On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- This heatsink is unique in that it also cools the DSP via an additional thermal pad. DSP is not cooled in most chassis.
- Has a heatpipe
C/C' chassis heatsink
- On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- Has no heatpipe, but larger fin area (compared to B/B' chassis)
AB-chassis heatsink
D/D' chassis heatsink
- On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
F-chassis heatsink (type 1, large aluminum fins)
F-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)
G-chassis heatsink (type 1, large aluminum fins)
G-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)
H-chassis heatsink
I-chassis heatsink
J-chassis heatsink
K-chassis heatsink (separate EE and GS)
K-chassis heatsink (combined EE+GS)
L-chassis heatsink (separate EE and GS)
L-chassis heatsink (combined EE+GS)
M-chassis heatsink
N-chassis heatsink
P-chassis heatsink
R-chassis heatsink (large shield type)
Goes with the GH-071 board
R-chassis heatsink (small shield type)
Goes with the GH-072 board Also used in the Sony BRAVIA KDL22PX300