Talk:Flash (Hardware)

shops

Buying spare NAND/NOR parts:

• http://www.farnell.com/
• http://www.futureelectronics.com/

non PS3 related

PSP flash

ref. : http://hitmen.c02.at/files/yapspd/psp_doc/chap3.html

FAT

 TA-079 - Samsung K5E5658HCM-D060 (3.0V/2.5V)
 TA-080 -
 TA-081 - 
 TA-082 - Samsung K5E5658ACM-D060 (1.8V/1.8V)
 TA-086 - 

Slim

 TA-085 - Sharp LR388A1
 TA-088 - Sharp LR388A0 - PSP-2000

Brite

 TA-090 - 

Go

 TA-091 - 
 TA-094 -

X360

• Samsung K9F4G08U0M-K9F4G08U0A-K9F4G08U0B-K9F4G08U0C-K9F4G08U0D-K9F4G08U0E-K9F4G08U0Y-K9F4G08U0Z.pdf (1.05 MB) (not used in PS3, was asked in EF.net #progskeet-support (Xbox360 Jasper)
• Hynix h27ubg8t2atr (used in new glitchproof xbox 360 mobo)

H - Hynix
2 - Flash
7 - NAND 
u - 2.7V~3.6V VCC
bg - 32Gb
8 - x8 organisation
t - MLC + single die + large block
2 - 1nCE & 1 R/nB; Sequential Row Read Disable
a - 2nd generation
t - TSOP1
r - Lead & Halogen free

Datasheet: AAFDEd01.pdf (1.58 MB)

product serial breakdown

Macronix

Serial Flash

Device

25L: 3V, Serial Flash
25U: 1.8V, Serial Flash
25V: 2.5V, Serial Flash

Density

10: 1Mb
20: 2Mb
40: 4Mb
80: 8Mb
16: 16Mb
32: 32Mb
64: 64 Mb
128: 128Mb
256/257: 256Mb

Mode

05: Standard single I/O
06: Single in, Dual out
08: Unique ID
25/26: Default lock protection
33/35: MXSMIO - Multi in, Multi out
36: MXSMIO - Single in, Multi out
45: MXSMIO Duplex - Multi I/O with DTR
55: MXSMIO - Security type

Package Type

P: 300mil 8-PDIP
ZN: 8-WSON (6x5mm)
Z2: 8-WSON (8x6mm)
ZU: 8-USON
M: SOP
O: 173mil 8-TSSOP
XC: 24-ball TFBGA

Temperature Range

I: Industrial (-40'C to 85'C)
S: Automotive Grade 3 (-40'C to 85'C)
R: Automotive Grade 2 (-40'C to 105'C)
Q: Automotive Grade 1 (-40'C to 125'C)

Speed

10: 104MHz
12: 85MHz/86MHz
13: 75MHz
15: 66MHz
20: 50MHz
25: 40MHz

Option

G: RoHS Compliant

Parallel Flash

Device

29F: 5V, Parallel Flash
29LV / 29GL / 68GL: 3V, Parallel Flash
29LA / 29GA: Security Type, Parallel Flash

Density

20x: 2Mb
40x: 4Mb
80x: 8Mb
16x: 16Mb
32x: 32Mb
64x: 64 Mb
12x: 128Mb
25x: 256Mb
51x: 512Mb

Block Type

T: Top Boot
B: Bottom Boot
H: Uniform Sector, Highest Address Sector Protected
L: Uniform Sector, Lowest Address Sector Protected
U: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Highest Address Sector Protected
D: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Lowest Address Sector Protected

Package Type

P: 8-PDIP
M: SOP
Q: PLCC
T/T2: TSOP
XB: 0.8mm Ball Pitch / 0.3mm Ball Size
XC: 1.0mm Ball Pitch / 0.4mm Ball Size
XE: 0.8mm Ball Pitch / 0.4mm Ball Size
XF: 1.0mm Ball Pitch / 0.6mm Ball Size
XH: 0.5mm Ball Pitch / 0.3mm Ball Size
GB: 0.5mm Ball Pitch / 0.25mm Ball Size
XG: 0.8mm Ball Pitch / 0.4mm Ball Size

Temperature Range

C: Commercial (-0'C to 70'C)
I: Industrial (-40'C to 85'C)
S: Automotive Grade 3 (-40'C to 85'C)
R: Automotive Grade 2 (-40'C to 105'C)
Q: Automotive Grade 1 (-40'C to 125'C)

Speed

55: 55ns
70: 70ns
90: 90ns
10: 100ns
11: 110ns

Option

G: RoHS Compliant
Q: Restricted   VCC: (3.0V-3.6V) RoHS Compliant

NAND Flash

Device

30: NAND Flash

Voltage

L: 2.7V to 3.6V

Classification

F: SLC+Large Block

Density

12: 512Mb
1G: 1Gb

Option Code

08=x8

Mode

A-Die#:1, CE#:1, R/B#:1, Reserve:0

Package Type

T: 48TSOP
XK: 0.8mm Ball Pitch / 0.45mm Ball Size of VFBGA
RoHS Compliant

Temperature Range

I: Industrial (-40'C to 85'C)