Flash (Hardware)
Flash
The PS3 uses a NOR interface from the South Bridge to address the main firmware flash. On NAND based consoles, it uses the Starship2 as an interleaving bridge chip to the two NAND flash, while on NOR based consoles the single NOR flash is connected directly to the South Bridge.
SKU Differentiation
CECHA/COK-001 up to including CECHE/COK-002W : 2x Samsung K9F1G08U0A-PIB0 (NAND 2x1Gbit=256MB total)
CECHG/SEM-001 : 2x Samsung K9F1G08UOB-PIB0 (NAND 2x1Gbit=256MB total)
CECHH/DIA-001 up to including CECHK/DIA-002 : 1x Spansion S29GL128N90TFIR2 (NOR 16MB)
CECHL/VER-001 (1-878-196-31) : 1x Spansion S29GL128P90TFIR2 (NOR 16MB)
CECHL/VER-001 and PS3 Slim 2... : 1x Samsung K8Q2815UQB-PI4B (NOR 16MB)
CECH-20../DYN-001 (1-880-055-31) 1x Samsung K8Q2815UQB-PI4B (NOR 16MB)
CECH-20../DYN-001 (1-880-055-??) 1x Macronix MX29GL128ELT2I-90G (NOR Flash)
CECH-250../JTP-001 : 1x Spansion S29GL128P90TFIR2 (NOR 16MB)
CECH-30../KTE-001 : 1x Spansion S29GL128P90TFIR2 (NOR 16MB) -OR- (conflicting reports) 1x Macronix MX29GL128ELT2I-90G (NOR Flash)
For a difference between models, see SKU Models
Pinout Flash chips
NAND
Samsung K9F1G08U0A-PIB0 or K9F1G08UOB-PIB0 (NAND)
productcode meaning: K - Memory 9 - NAND Flash F - Small Classification : SLC Normal 1G - Density : 1Gigabit (128MB) 0 - Technology : Normal (x8) 8 - Organisation : x8 U - Vcc Supply Voltage : min 2.7V - Max 3.6V / typ. 3.3V 0 - Mode : Normal A - Generation : 2nd - P - Package : 48pin TSOP1 (12mm x 20mm / 0.5mm pitch)) Lead-free I - Temperature : Industrial B - Customer Bad Block : Include Bad Block 0 - PreProgram Version : None
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NOR
Spansion S29GL128N90TFIR2 or S29GL128P90TFIR2 (NOR)
productcode meaning: S29GL128N - 3.0 Volt-only, 512 Megabit (32M x 16-bit/64Mx8-bit), Page-Mode, Flash Memory, 110nm 90 - Speed option : 90ns T - Package type: TSOP F - Package materials set : Lead-free I - Temperature range : Industrial R2 - ?Vio = 2.7 to 3.6V, lowest address sector protected?
Pin | Usage | Remarks |
---|---|---|
1 | A23 | No Connection for S29GL128N |
2 | A22 | |
3 | A15 | |
4 | A14 | |
5 | A13 | |
6 | A12 | |
7 | A11 | |
8 | A10 | |
9 | A9 | |
10 | A8 | |
11 | A19 | |
12 | A20 | |
13 | WE# | Write Enable |
14 | RESET# | Reset |
15 | A21 | |
16 | WP#/ACC | Write Protect / Accelerated Program Operation |
17 | RD/BY# | Ready/Busy Output |
18 | A18 | |
19 | A17 | |
20 | A7 | |
21 | A6 | |
22 | A5 | |
23 | A4 | |
24 | A3 | |
25 | A2 | |
26 | A1 | |
27 | NC | No Connection |
28 | NC | No Connection |
Pin | Usage | Remarks |
---|---|---|
29 | Vio | Vio - Output Buffer Power |
30 | NC | No Connection |
31 | A0 | |
32 | CE# | Chip Enable |
33 | VSS | Ground |
34 | OE# | Output Enable |
35 | DQ0 | |
36 | DQ8 | |
37 | DQ1 | |
38 | DQ9 | |
39 | DQ2 | |
40 | DQ10 | |
41 | DQ3 | |
42 | DQ11 | |
43 | Vcc | Vcc (min 2.7V-max 3.6V / typ 3.0V) |
44 | DQ4 | |
45 | DQ12 | |
46 | DQ5 | |
47 | DQ13 | |
48 | DQ6 | *OTP? |
49 | DQ14 | |
50 | DQ7 | *OTP? |
51 | DQ15/A-1 | |
52 | VSS | Ground |
53 | #BYTE | BYTE# Selects 8-bit or 16-bit mode (NC on Samsung NOR) |
54 | A16 | |
55 | NC | No Connection |
56 | A24 | No Connection for S29GL128N and S29GL256N |
Samsung K8Q2815UQB-PI4B (NOR)
productcode meaning: K - Memory 8 - NOR Flash Q - Small Classification : Page Mode DDP 28 - Density : 128M, 8M / 16Bank / 8^8 15 - Dual Bank Boot Block (Bank1, Bank2) : 16M, 2M / 14M U - Vcc : 3.0V / 3.3V (2.7V~3.6V) Q - Device Type: Top and Bottom Boot Block B - Generation : 3rd Generation - P - Package : TSOP1 (Lead Free) I - Temp : Industrial 4B - Speed : 60ns/25ns (Page)
Pin | Usage | Remarks |
---|---|---|
1 | NC | No Connection |
2 | A22 | |
3 | A15 | |
4 | A14 | |
5 | A13 | |
6 | A12 | |
7 | A11 | |
8 | A10 | |
9 | A9 | |
10 | A8 | |
11 | A19 | |
12 | A20 | |
13 | WE | Write Enable |
14 | RESET | Reset |
15 | A21 | |
16 | WP/ACC | Write Protect / Accelerated Program Operation |
17 | RD/BY | Ready/Busy Output |
18 | A18 | |
19 | A17 | |
20 | A7 | |
21 | A6 | |
22 | A5 | |
23 | A4 | |
24 | A3 | |
25 | A2 | |
26 | A1 | |
27 | NC | No Connection |
28 | NC | No Connection |
Pin | Usage | Remarks |
---|---|---|
29 | VCCQ | VccQ |
30 | NC | No Connection |
31 | A0 | |
32 | CE | Chip Enable |
33 | VSS | Ground |
34 | OE | Output Enable |
35 | DQ0 | |
36 | DQ8 | |
37 | DQ1 | |
38 | DQ9 | |
39 | DQ2 | |
40 | DQ10 | |
41 | DQ3 | |
42 | DQ11 | |
43 | Vcc | Vcc (min 2.7V-max 3.6V / typ 3.0V) |
44 | DQ4 | |
45 | DQ12 | |
46 | DQ5 | |
47 | DQ13 | |
48 | DQ6 | *OTP? |
49 | DQ14 | |
50 | DQ7 | *OTP? |
51 | DQ15 | |
52 | VSS | Ground |
53 | NC | No Connection |
54 | A16 | |
55 | NC | No Connection |
56 | NC | No Connection |
- OTP Block Region : 256-word Flash memory region. The data DQ6=1 for customer locked and DQ7=1 for factory locked
Macronix MX29GL128ELT2I-90G (NOR)
productcode meaning: MX29GL Series 3V 128 Mb 16M x 8/8M x 16 90ns Parallel Flash TSOP-56
Pin | Usage | Remarks |
---|---|---|
1 | NC | No Connection |
2 | A22 | |
3 | A15 | |
4 | A14 | |
5 | A13 | |
6 | A12 | |
7 | A11 | |
8 | A10 | |
9 | A9 | |
10 | A8 | |
11 | A19 | |
12 | A20 | |
13 | WE# | Write Enable |
14 | RESET# | Reset |
15 | A21 | |
16 | WP#/ACC | Write Protect / Accelerated Program Operation |
17 | RD/BY# | Ready/Busy Output |
18 | A18 | |
19 | A17 | |
20 | A7 | |
21 | A6 | |
22 | A5 | |
23 | A4 | |
24 | A3 | |
25 | A2 | |
26 | A1 | |
27 | NC | No Connection |
28 | NC | No Connection |
Pin | Usage | Remarks |
---|---|---|
29 | VI/O | Vcc I/O (min 2.7V-max 3.6V / typ 3.0V) |
30 | NC | No Connection |
31 | A0 | |
32 | CE# | Chip Enable |
33 | GND | Ground |
34 | OE# | Output Enable |
35 | Q0 | |
36 | Q8 | |
37 | Q1 | |
38 | Q9 | |
39 | Q2 | |
40 | Q10 | |
41 | Q3 | |
42 | Q11 | |
43 | Vcc | Vcc (min 2.7V-max 3.6V / typ 3.0V) |
44 | Q4 | |
45 | Q12 | |
46 | Q5 | |
47 | Q13 | |
48 | Q6 | |
49 | Q14 | |
50 | Q7 | |
51 | Q15/A-1 | Q15 (Word Mode) / LSB addr (Byte Mode) |
52 | GND | Ground |
53 | BYTE# | Selects 8bits or 16bits mode |
54 | A16 | |
55 | NC | No Connection |
56 | NC | No Connection |
Pinout Other
Renesas HN58X2504TIE (EEPROM)
Note: although edepot&others lists it on the board, I can only find this IC in the sixaxis.
Datasheet
productcode meaning: H - N - 5 - 8 - Organisation : x8bit X - 2 - 5 - 0 - 4 - Density : 4-kbit (512x8bit) T - Package : 8pin plastic TSSOP (TTP-8DAV) I - Temp : Industrial (-40 to +85 °C E - Environment : Lead Free
Each PS3 has a special EEPROM chip on the motherboard using a SPI Serial Interface Renasas chip.
Type | Size | Speed | Voltage | Packaging | Manufacturer | Serial Number | Description |
---|---|---|---|---|---|---|---|
EEPROM | 4-kbit (512x8bit) | 3MHz | 1.8V to 5.5V | 8-pin TSSOP | Renesas | HN58X2504TIE | PS3 EEPROM chip |
Pin | Usage | Remarks |
---|---|---|
1 | S | Chip Select |
2 | Q | Serial data output |
3 | W | Write Protect |
4 | VSS | Ground |
5 | D | Serial data input |
6 | C | Serial Clock |
7 | HOLD | Hold |
8 | VCC | Vcc (min 1.8V-max 5.5V) |