Heatsink: Difference between revisions
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= B/B' chassis heatsink = | = B/B' chassis heatsink = | ||
* On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | |||
* This heatsink is unique in that it also cools the [[DSP]] via an additional thermal pad. DSP is not cooled in most chassis. | |||
* Has a heatpipe | |||
= C/C' chassis heatsink = | = C/C' chassis heatsink = | ||
* On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | |||
* Has no heatpipe, but larger fin area (compared to B/B' chassis) | |||
= AB-chassis heatsink = | = AB-chassis heatsink = | ||
= D/D' chassis heatsink = | = D/D' chassis heatsink = | ||
* On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | |||
= F-chassis heatsink (type 1, large aluminum fins) = | = F-chassis heatsink (type 1, large aluminum fins) = | ||
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= R-chassis heatsink (small shield type) = | = R-chassis heatsink (small shield type) = | ||
''Goes with the GH-072 board'' | ''Goes with the GH-072 board'' | ||
''Also used in the [[Sony BRAVIA KDL22PX300]]'' | ''Also used in the [[Sony BRAVIA KDL22PX300]]'' | ||
= [[PSX]] heatsink = | = [[PSX]] heatsink = | ||
Latest revision as of 13:43, 2 December 2023
Overview[edit | edit source]
This page is currently work-in-progress. (November 2023)
A/A+ chassis heatsink[edit | edit source]
B/B' chassis heatsink[edit | edit source]
- On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- This heatsink is unique in that it also cools the DSP via an additional thermal pad. DSP is not cooled in most chassis.
- Has a heatpipe
C/C' chassis heatsink[edit | edit source]
- On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- Has no heatpipe, but larger fin area (compared to B/B' chassis)
AB-chassis heatsink[edit | edit source]
D/D' chassis heatsink[edit | edit source]
- On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
F-chassis heatsink (type 1, large aluminum fins)[edit | edit source]
F-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)[edit | edit source]
G-chassis heatsink (type 1, large aluminum fins)[edit | edit source]
G-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)[edit | edit source]
H-chassis heatsink[edit | edit source]
I-chassis heatsink[edit | edit source]
J-chassis heatsink[edit | edit source]
K-chassis heatsink (separate EE and GS)[edit | edit source]
K-chassis heatsink (combined EE+GS)[edit | edit source]
L-chassis heatsink (separate EE and GS)[edit | edit source]
L-chassis heatsink (combined EE+GS)[edit | edit source]
M-chassis heatsink[edit | edit source]
N-chassis heatsink[edit | edit source]
P-chassis heatsink[edit | edit source]
R-chassis heatsink (large shield type)[edit | edit source]
Goes with the GH-071 board
R-chassis heatsink (small shield type)[edit | edit source]
Goes with the GH-072 board
Also used in the Sony BRAVIA KDL22PX300