EE+GS: Difference between revisions

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== Revisions ==
== Revisions ==
*GS 1.12 + EE 4.2: CXD9797GB (PSX first revision motherboard XPD-001)
*GS 1.12 + EE 4.2: CXD9797GB (PSX first revision motherboard XPD-001)
** 86 mm² die size
** 86 mm² die size with "CMOS4 90 nm" process
*GS 1.12 + EE 4.2: CXD9833GB (? - GH-051-32 - ?)
*GS 1.12 + EE 4.2: CXD9833GB (? - GH-051-32 - ?)
*GS 1.13 + EE 4.2: CXD2953AGB (GH-035-XX, GH-051-51, PlayStation 3 COK-001)
*GS 1.13 + EE 4.2: CXD2953AGB (GH-035-XX, GH-051-51, PlayStation 3 COK-001)
** ~60 mm² die size
** ~60 mm² die size, likely with a more advanced 90 nm process


For SCPH-79XXX and newer PS2 consoles, GS was separated from EE again and EE was combined with IOP, SPU2 and RDRAM instead.
For SCPH-79XXX and newer PS2 consoles, GS was separated from EE again and EE was combined with IOP, SPU2 and RDRAM instead.

Revision as of 03:07, 4 July 2022

Combination of Emotion Engine and Graphics Synthesizer used on some slim PS2 motherboards, in the japanese-only PSX DVR and in Japan/US launch model PS3 consoles. One of the first mass-produced 90nm ICs, as claimed by Sony. This claim is however disputed. Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known[1]:

  • EE: 128 bit RISC
  • GS: Parallel rendering processor with embedded DRAM
  • Process: 90 nm
  • Total number of transistors: 53.5 million
  • Embedded DRAM: 4 MB
  • Memory size: 0.19 µm²
  • Clock frequency: 294.912 Mhz
  • Power consumption: 8 W (initial power consumption was 37 W two chips total)
  • Metal layer: 5
  • Die size: 86 mm² (initial die size was 413 mm² two chips total)
  • Package: 536 pin EBGA

Revisions

  • GS 1.12 + EE 4.2: CXD9797GB (PSX first revision motherboard XPD-001)
    • 86 mm² die size with "CMOS4 90 nm" process
  • GS 1.12 + EE 4.2: CXD9833GB (? - GH-051-32 - ?)
  • GS 1.13 + EE 4.2: CXD2953AGB (GH-035-XX, GH-051-51, PlayStation 3 COK-001)
    • ~60 mm² die size, likely with a more advanced 90 nm process

For SCPH-79XXX and newer PS2 consoles, GS was separated from EE again and EE was combined with IOP, SPU2 and RDRAM instead.