Editing IHS removal
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Removal of the CELL is slightly more tricky as it involves cutting the silicone sealant that surrounds the chip without scratching or ripping any of the traces on the top of the chip. This process is further complicated by the fact that after the 25XX revision Sony began to use solder to also secure the IHS and later thermal adhesive to secure others. The only way of determining what is underneath the IHS of the later CELL models is by cutting the adhesive and seeing if the IHS comes free with little to no force. <br /> | Removal of the CELL is slightly more tricky as it involves cutting the silicone sealant that surrounds the chip without scratching or ripping any of the traces on the top of the chip. This process is further complicated by the fact that after the 25XX revision Sony began to use solder to also secure the IHS and later thermal adhesive to secure others. The only way of determining what is underneath the IHS of the later CELL models is by cutting the adhesive and seeing if the IHS comes free with little to no force. <br /> | ||
<span style="background:red; color:#ffffff;"> | <span style="background:red; color:#ffffff;">Warning, if you have cleanly cut the silicone around the IHS and it did not come off without any force you have a solder/adhesive model. Continuing to force the IHS off will likely result in the CELL die cracking and the console becoming a permanent brick.</span> | ||
=Tutorials= | =Tutorials= | ||