Template:CELL pad layout 65nm

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CELL 65nm pad layout (CELL view)
Pad A1 at top-left corner
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CELL pad layout 65nm
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Pad Name Type Description
Internal External
AV13 SPI_SI BE_SPI_DO
In
 Connected to Syscon pad N2 (BGA 200 pads layout), or pin 80 (LQFP 128 pins layout)
AV23 THERMAL_OVERLOAD SYS_THR_ALRT
Out
 Connected to Syscon pad E9(BGA 200 pads layout), or pin UNK (LQFP 128 pins layout) through transistor
AW13 SPI_EN BE_SPI_CS
In
 Connected to Syscon pad M2 (BGA 200 pads layout), or pin 83 (LQFP 128 pins layout)
AW18 HARD_RESET BE_RESET_AND
In
 Connected to Syscon pad P2 (BGA 200 pads layout), or pin UNK (LQFP 128 pins layout)
AY13 SPI_CLK BE_SPI_CLK
In
 Connected to Syscon pad N1 (BGA 200 pads layout), or pin 82 (LQFP 128 pins layout)
BA13 SPI_SO BE_SPI_DI
Out
 Connected to Syscon pad M1 (BGA 200 pads layout), or pin 81 (LQFP 128 pins layout) through 47 resistor
BA17 ATTENTION BE_INT
Out
 Connected to Syscon pad T2 (BGA 200 pads layout), or pin 3 (LQFP 128 pins layout)
BA19 POWER_GOOD BE_POWGOOD
In
 Connected to Syscon pad P1 (BGA 200 pads layout), or pin UNK (LQFP 128 pins layout)
AV29 STI_THERMAL[0]
Out
 Connected to CELL temperature monitor pin 2 (D+)
AU29 STI_THERMAL[1]
Out
 Connected to CELL temperature monitor pin 3 (D-)
C15 STI_THERMAL2[0]
Not Connected
 Not connected
B14 STI_THERMAL2[1]
Not Connected
 Not connected
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