Editing User talk:Zecoxao

= Symbols on Kernel =

* 0.80 Kernel -> Number of Symbols:11540, Number of Unknown subs:2, Total:11542, Ratio: 99%
* 1.01 Kernel ->  Number of Symbols:16748, Number of Unknown subs:1, Total: 16749, Ratio: 99%
* 1.01 EapCore -> Number of Symbols:11372, Number of Unknown subs:95,Total: 11467, Ratio: 99%
* 1.02 Kernel -> to look
* 1.03 Kernel -> to look
* 1.05 Kernel -> Number of Symbols:9805, Number of Unknown subs:2954, Total:12759, Ratio: 76%
* 1.05 Devkit Kernel (with Rizzo) -> Number of Symbols: 14054, Number of Unknown subs: 1347, Total: 15401
* 1.62 EapCore -> Number of Symbols:13126,  Number of Unknown subs:119,  Total:13245, Ratio: 99%
* 1.76 Kernel -> Number of Symbols:10383, Number of Unknown subs:2982, Total:13365, Ratio: 77%

= Cavern Chip Labels =

<pre>
IDT6V4
1265NLG
1252L
QT14H599Y

MXIC X124511
MX25L25635FMI-10G
8A024000A3

32.768K
E BMN

Panasonic
MN86471A
248P2090

88EC120-BNS2
N6K28600 8JW
1250 C0 ES
TW

SEC 237 HCH9
K4B4G0846B
GMH146D1

F TAIWAN
MB86C311B
1252 B27
E2
ARM

R5F100PLA
1235KM412
MALAYSIA

20689DD25A0D
TRS8797-E2 Rev.XX
SP88W8797-MA0-2E2T00-001
CP-CC007W L-EVT2

F DC37AH
FDMF
6820C

ZG100273F845G
ES L3 S2 FL3
F377301B30114
DIFFUSED IN TAIWAN
MADE IN TAIWAN

IOR
3585A
N249P
DAF0

PW554A
2AK __G4
D85C

53123A
28K __G4
D5XX

MXIC MX
25L8006E
M2I-12G
3L325700
L124875

88EC060-NN82
NAX8340.19
1202 AQP
TW

SAMSUNG 303
K4G41325FC-HC03 - GDDR5 RAM

</pre>

= MTW Chip Labels =

<pre>
M
88E6172-TFJ2
PMK8840.1JW
1240 A1R
TW

PLX
TECHNOLOGY
USB3380-ABSONI G
1245
8598E
TAIWAN

GL3520
???????????
??????????????

WINBOND
25X10CLNIG -> usb hub firmware (1Mbit, 128KByte)
1245

53123A
24K__G4
C4KS
</pre>

= BRG Chip Labels =

<pre>
BD7763EFV
251 T52

BD9685
2421

RENESAS SCEI
R8J32841FP3 -> bluray main chip 
0011M 1246
21CBF759 TAIWAN
</pre>

= Kernel Sizes (Encrypted,Compressed) =

{| class="wikitable sortable"
|-
! Version !! Type !! Size !! Notes 
|-
| GEN3-1_000_051 || devkit  || 9.674.642 bytes ||
|-
| GEN3-1_000_091 || testkit || 9.572.626 bytes ||
|-
| GEN3-1_010_031 || testkit || 9.775.906 bytes || Similar size to 1.01 retail (diff 128 bytes) 
|-
| GEN3-1_010_031 || devkit  || 9.856.066 bytes || Larger than 1.01 retail (diff 80288 bytes)
|-
| GEN3-1_020_041 || testkit || 9.800.018 bytes || Larger than 1.01 retail (diff 24240 bytes)
|-
| 1.01 || retail  || 9.775.778 bytes || Internal Symtab Inside
|-
| 1.05 || retail || 8.413.713 bytes || External Symtab Inside Only
|-
| 2.04 || retail || 9.293.121 bytes ||
|-
| 2.50 || retail || 9.138.369 bytes ||
|-
|}

hey do you have any more insight into the main-flash? id love some feedback whilst i am developing my nor validator.
* i do not, sorry. samu keys are required to decrypt it and they're not public
bummer, it is not fun validating and re-validating the CID by myself :(
* i like what you're doing/contributing - you're officially my new idol, seeing as EussNL has disappeared

= Testkit Links =

* https://disk.yandex.com/d/zB7e2AgxxMMtbQ

= Devkit Links =

* https://disk.yandex.com/d/UDvlHH1zC4FJwA

= Retail Links (SYS) =

* https://disk.yandex.com/d/yBhjiqAU-F0cYA

= DEM-3000P Chip Labels =

<pre>

Main Board IRT-002

(NAND EMMC Below)
TOSHIBA
THGBM3G5D1FBAIE
SV4979
TAIWAN
11130AE

(Kermit Below)
T9ML7MBG-T

(Syscon Below)
D79F0109

(Audio Codec Below)
WM1803E

CP Board GCP-002

(Unknown, Microcontroller)
PIC16F724

(EMMC, Samsung Manufacturer)
Samsung KLMG1DEHE - B101

(RAM, Samsung Manufacturer)
Samsung K4X2G323PC 8GD8

(Main CPU, Renesas Manufacturer)
Renesas KD77630AF1 EMI-S (Emma Mobile)

</pre>