Components
Jump to navigation
Jump to search
Hardware Analysis
PCH-1000
Report by www.electronicproducts.com / www.electronicproducts.com via IHS technology
PARENT COMPONENT | CHILD COMPONENT | PARENT CATEGORY | CHILD CATEGORY | QTY | MANUFACTURER | PART# | GENERAL DESCRIPTION | SPECIFIC DESCRIPTION | TYPE | PHOTOS | NOTES |
---|---|---|---|---|---|---|---|---|---|---|---|
Battery | Battery | Battery | Li Ion | 1 | Sony Energy Devices Corporation | SP65M | Battery - Li-Ion, 3.7V, 2210mAh, w/ Power Management Circuit, Integrated 3 Discrete Wires, 1 3-Position Pin Socket Connector. (Lenght) 80.50mm x (Width) 45.40mm x (Height) 6.50mm | MODEL SP65M, Li-ion BATTERY PACK 3.7V 2210mAh, MADE IN CHINA, 8.2Wh 4-260-681-01 | |||
Battery | Battery | Battery | Li Ion | 1 | Sony Energy Devices Corporation | SP654580 | Battery Cell - Li-Ion, 3.7V, 2210mAh. (Lenght) 65mm x (Width) 45mm x (Height) 5.80mm | Sony 26W, SP654580 A10S, 00414K045TJ09A | |||
Display / Touchscreen Module | Display & Touch | Display | OLED | 1 | Samsung Mobile Display | AMS495QA01 | OLED Display Unit - 5" Diagonal, 16M Color AMOLED, 960 x 544 Pixels, 115um x 115um Pixel Size, 110mm x 62.5mm Viewable Area | Logo, AMS495QA01 REV14.2, 2011.07.20, S111101123451 | See Display | ||
Display PCB | I/O & Interface | Passive | Capacitor | 24 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Display PCB | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Hirose | Board to Board - Plug, Gold Plated Contacts | HRS, 2U | SMD | |||
Display PCB | I/O & Interface | Discrete Semi | Diode | 1 | Rohm | RB520S-30 | Schottky Barrier - 30V, 200mA | B | SOD523 | ||
Display PCB | I/O & Interface | Passive | Magnetic | 3 | Ferrite Bead - Arrayx2 | 303 | |||||
Display PCB | I/O & Interface | Passive | Resistor | 6 | SMD Flat Chip | 402 | |||||
Enclosure, Main | Mechanical / Electro-Mechanical | Electro Mechanical | Acoustics | 2 | Loudspeaker - w/ 2 Gold Plated Contacts & Metal Shielding | J02, q145 | |||||
Enclosure, Main | Mechanical / Electro-Mechanical | Electro Mechanical | Antenna | 1 | Internal B - Etched Copper On Flexible Substrate, w/ PSA | 29058121 D1 | |||||
Enclosure, Main | Mechanical / Electro-Mechanical | Electro Mechanical | Antenna | 1 | GPS - Etched Copper On Flexible Substrate, w/ PSA | 29058109.02, 11465B4.0 | |||||
Enclosure, Main | Mechanical / Electro-Mechanical | Electro Mechanical | Antenna | 1 | Internal A - Etched Copper On Flexible Substrate, Painted, w/ PSA | 29062968 P5 WK41 | |||||
Enclosure, Main | Mechanical / Electro-Mechanical | Electro Mechanical | Antenna | 1 | WLAN / Bluetooth - Etched Copper On Flexible Substrate, Painted, w/ PSA | 29062934 P5 WK41 | |||||
Enclosure, Main | Mechanical / Electro-Mechanical | Mechanical | Hardware | 3 | Fastener - Machine Screw, M1.6 x 4.5mm, Philips Flat Head, Painted | ||||||
Enclosure, Main | Mechanical / Electro-Mechanical | Mechanical | Hardware | 15 | Fastener - Machine Screw, M1.6 x 5mm, Philips Flat Head, Painted | ||||||
Enclosure, Main | Mechanical / Electro-Mechanical | Mechanical | Hardware | 3 | Fastener - Machine Screw, M1.6 x 5.4mm, Philips Flat Head, Painted | ||||||
Enclosure, Main | Mechanical / Electro-Mechanical | Mechanical | Hardware | 1 | Fastener - Machine Screw, M1.6 x 5.4mm, Philips Flat Head | ||||||
Enclosure, Main | Mechanical / Electro-Mechanical | Mechanical | Hardware | 2 | Fastener - Machine Screw, M1.6 x 4.6mm, Hex Flat Head | ||||||
Enclosure, Main | Mechanical / Electro-Mechanical | Mechanical | Hardware | 5 | Fastener - Machine Screw, M1.6 x 6.4mm, Philips Flat Head, Black Oxide Finish | ||||||
Enclosure, Main | Mechanical / Electro-Mechanical | Mechanical | Metals | 1 | Mounting Tab - Stamped / Formed Aluminum | L 2 | |||||
Enclosure, Main | Mechanical / Electro-Mechanical | Mechanical | Metals | 1 | Mounting Tab - Stamped / Formed Aluminum | M 2 | |||||
Enclosure, Main | Mechanical / Electro-Mechanical | Mechanical | Metals | 1 | Mounting Tab - Stamped / Formed Aluminum | 1 R | |||||
Enclosure, Main | Mechanical / Electro-Mechanical | Mechanical | Metals | 1 | Mounting Tab - Stamped / Formed Metal | 3 | |||||
Half Mini PCIe Module | Baseband / RF / PA | Integrated Circuit | Analog | 1 | Sony | CXM3555ER | Antenna Switch - SP10T, w/ Integrated Filters & Compatible Decoder | M3555, AS1V, 133 | QFN | ||
Half Mini PCIe Module | Baseband / RF / PA | Integrated Circuit | Analog | 1 | LNA - GPS | 311H | SMD | ||||
Half Mini PCIe Module | Baseband / RF / PA | Integrated Circuit | Analog | 1 | Avago Technologies | ACPM-5005 | PAM - WCDMA / HSPA+ 850, 815-849MHz | A5005, K1128, ODF144 | SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Integrated Circuit | Analog | 1 | Avago Technologies | ACPM-5002 | PAM - WCDMA 1900, 1850-1915MHz | A5002, K1127, ODD081 | SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Integrated Circuit | Analog | 1 | Avago Technologies | ACPM-5008 | PAM - WCDMA / HSPA+ 900, 897.5MHz | A5008, K1132, ODG015 | SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Integrated Circuit | Analog | 1 | Avago Technologies | ACPM-5001 | PAM - WCDMA / HSPA+ 2100, 1950MHz | A5001, KI127, ODC061 | SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Integrated Circuit | Analog | 1 | Avago Technologies | ACPM-7868 | PAM - Quad-Band GSM / EDGE | AVAGO, ACPM-7868, K1128, DL142 | SMD | ||
Half Mini PCIe Module | Power Supply | Integrated Circuit | Analog | Qualcomm | PM8028 | 1x Die - Power Management IC | HG11-VK495-200 | ||||
Half Mini PCIe Module | Power Supply | Integrated Circuit | Analog | 1 | Qualcomm | PM8028 | Power Management IC | QUALCOMM, PM8028, A10618.1, F11330B4 | BGA | ||
Half Mini PCIe Module | Power Supply | Passive | Capacitor | 4 | Ceramic Multilayer - C0G/NP0 | Gray | 201 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Capacitor | 4 | Ceramic Multilayer - C0G/NP0 | Violet | 201 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Capacitor | 1 | Ceramic Multilayer - C0G/NP0 | Gray | 402 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Capacitor | 1 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Half Mini PCIe Module | Memory | Passive | Capacitor | 8 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Half Mini PCIe Module | Memory | Passive | Capacitor | 2 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Capacitor | 5 | Ceramic Multilayer - X5R/X7R | Brown | 603 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Capacitor | 4 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Capacitor | 53 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Capacitor | 39 | Ceramic Multilayer - C0G/NP0 | Violet | 201 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Capacitor | 15 | Ceramic Multilayer - C0G/NP0 | Gray | 402 | ||||
Half Mini PCIe Module | Power Supply | Passive | Capacitor | 18 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Half Mini PCIe Module | Power Supply | Passive | Capacitor | 5 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Half Mini PCIe Module | Power Supply | Passive | Capacitor | 13 | Ceramic Multilayer - X5R/X7R | Brown | 603 | ||||
Half Mini PCIe Module | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 3 | Coaxial Receptacle - Vertical, Subminiature, Gold Plated | SMD | |||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Crystal | 1 | TXC | 7M Series | Crystal - 19.200MHz | T192, Mh9A | 2.5x3.2 SMD | ||
Half Mini PCIe Module | Power Supply | Passive | Crystal | 1 | Epson Toyocom | FC-135 | Crystal - 32.768kHz | A140C | 1.5x3.2 SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Discrete Semi | Diode | 2 | Diode | 5V | SOD923 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Filter | 1 | Murata | SAFEA942MFL0F00 | Rx RF SAW Filter - GSM 900, 942.5MHz | Logo R, MZ | 1.05x1.35 SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Filter | 1 | Murata | RX RF SAW Filter - Dual-Band GSM | Logo e, SR | 1.35x1.8 SMD | |||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Filter | 1 | Murata | SAFEA1G58FB0F00 | RX RF SAW Filter - GPS/GLONASS, 1575.42/1602MHz | Logo g, DW | 1.05x1.35 SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Filter | 1 | Murata | SAFEA1G58KA0F00 | RX RF SAW Filter - GPS/GLONASS, 1575.42/1602MHz | Logo g, D1 | 1.05x1.35 SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Filter | 1 | Avago Technologies | ACMD-7410 | Duplexer - CDMA 1900, 1850.48/1909.52MHz | AVAGO, A2FI132, 092623 | SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Filter | 1 | Murata | SAYFP897MCA0B00 | Duplexer - WCDMA 900, 897.5/942.5MHz | Logo Fb, S2B | 2x2.5 SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Filter | 1 | Murata | SAYFP836MCA0F00 | Duplexer - WCDMA 850, 836.5/881.5MHz | Logo wg, S00 | 2x2.5 SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Filter | 1 | Epcos | B39212B7964P810 | Duplexer - WCDMA 2100, 1950/2140MHz | EPCOS, 7964, JP87 | 2x2.5 SMD | ||
Half Mini PCIe Module | Baseband / RF / PA | Integrated Circuit | Logic | 1 | Qualcomm | MDM6200 | Baseband / RF Transceiver - GSM/WCDMA/HSPA+ | QUALCOMM R, MDM6200, BN38PC, C1134007 | BGA | ||
Half Mini PCIe Module | Baseband / RF / PA | Integrated Circuit | Logic | Qualcomm | MDM6200 | 1x Die 1 - Baseband | Die Marking: HG11-VJ130 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Integrated Circuit | Logic | Qualcomm | MDM6200 | 1x Die 2 - RF Transceiver - Dual Mode, GSM/EDGE/EVDOrB/HSPA+, Multi-Band | Die Marking: HG11-VF535-220 | ||||
Half Mini PCIe Module | Power Supply | Passive | Magnetic | 4 | Inductor - Wound Ferrite Core, Shielded | SMD | |||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Magnetic | 1 | Inductor - Ceramic Multilayer | 1/2 Gray / White | 201 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Magnetic | 2 | Inductor - Ceramic Multilayer | 1/2 Black / White | 201 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Magnetic | 3 | Inductor - Ceramic Multilayer | Blue w/ White Dot | 201 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Magnetic | 21 | Inductor - Ceramic Multilayer | 1/2 Gray / White | 201 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Magnetic | 22 | Inductor - Ceramic Multilayer | Blue w/ White Dot | 201 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Magnetic | 19 | Inductor - Ceramic Multilayer | 1/2 Gray / White | 402 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Magnetic | 3 | Inductor - Ceramic Multilayer | 1/2 Black / Green | 402 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Magnetic | 1 | Ferrite Bead | 402 | |||||
Half Mini PCIe Module | Memory | Integrated Circuit | Memory | 1 | Toshiba Semiconductor | Y890A111222KA | MCP - 512Mb NAND Flash + 256Mb Mobile SDRAM | Logo CHINA, Y890A111222KA, ZX3581 1135KND | BGA | ||
Half Mini PCIe Module | Memory | Integrated Circuit | Memory | Toshiba Semiconductor | Y890A111222KA | 1x Die 1 - Toshiba 512Mb NAND Flash | Die Marking: Toshiba GWM2 | ||||
Half Mini PCIe Module | Memory | Integrated Circuit | Memory | Toshiba Semiconductor | Y890A111222KA | 1x Die 2 - Hynix H55S2562J 256Mb Mobile SDRAM | Die Marking: H55S2562J, DTC05AA (see picture) | ||||
Half Mini PCIe Module | Mechanical / Electro-Mechanical | Module | Other | 1 | Chi Mei Communications Systems | ZOEDA-BB1-S9-17618 | 3G Half Mini PCIe Module - Quad-Band WCDMA/HSUPA/HSDPA, Quad-Band GSM/EDGE | CE0682 AD110301003, 003XYA110299, 003MWA110300, Barcodes, Sony P/N:1-489-770-31, S/N:ZOEDA-BB1-S9-17618, IMEI: 358459044116214, FCC ID: QDJZOE, Made in China Model: ZOE | See Wireless_communications | ||
Half Mini PCIe Module | Mechanical / Electro-Mechanical | Electro Mechanical | PCB | 1 | Nan Ya Pcb | 10-Layer - FR4/RCF HDI, 3+4+3, Lead-Free, Halogen-Free | B1P-0116202-A010 Logo NM10 94V-0, M1011-D1 S8, 1138 | ||||
Half Mini PCIe Module | Power Supply | Passive | Resistor | 10 | SMD Flat Chip | 201 | |||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Resistor | 2 | SMD Flat Chip | 201 | |||||
Half Mini PCIe Module | Memory | Passive | Resistor | 1 | SMD Flat Chip | 402 | |||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Resistor | 16 | SMD Flat Chip | 201 | |||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Resistor | 1 | SMD Flat Chip | 402 | |||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Resistor | 23 | SMD Flat Chip | 201 | |||||
Half Mini PCIe Module | Baseband / RF / PA | Passive | Resistor | 1 | SMD Flat Chip | 402 | |||||
Half Mini PCIe Module | Baseband / RF / PA | Module | RF | 1 | SAW Module | SWUA, D88, D136 | SMD | ||||
Half Mini PCIe Module | Baseband / RF / PA | Discrete Semi | Transistor | 1 | Transistor | L8 | SOT563 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Discrete Semi | Transistor | 2 | Transistor | N4 | SOT723 | ||||
Half Mini PCIe Module | Baseband / RF / PA | Discrete Semi | Transistor | 1 | Toshiba Semiconductor | SSM3J16FV | MOSFET - P-Channel, -20V, -100mA | DT | SOT723 | Datasheet | |
Left Button PCB | Mechanical / Electro-Mechanical | Electro Mechanical | PCB | 1 | Honghengsheng Electronical Technology(Huaian) | 2-Layer - FR4, Lead-Free, Halogen-Free | E253117, 11421, DS1, 94V-0, IRL-002, 1-884-529-21, >EP GW<, LF, HF | ||||
Left Button PCB, Bottom | I/O & Interface | Passive | Capacitor | 2 | Ceramic Multilayer - C0G/NP0 | Violet | 402 | ||||
Left Button PCB, Bottom | I/O & Interface | Passive | Capacitor | 5 | Ceramic Multilayer - C0G/NP0 | Violet | 201 | ||||
Left Button PCB, Bottom | I/O & Interface | Passive | Capacitor | 5 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Left Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Ground Contact - Stamped / Formed Metal | SMD | |||||
Left Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Ground Contact - Stamped Metal, Gold Plated | SMD | |||||
Left Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip | B1 | SMD | ||||
Left Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip | A8 | SMD | ||||
Left Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip | MXJ, A5 | SMD | ||||
Left Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 2 | Loudspeaker Contact - Stamped Metal, Gold Plated | SMD | |||||
Left Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Coaxial Receptacle - Vertical, Subminiature, Gold Plated | SMD | |||||
Left Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 2 | Antenna Contact - Stamped / Formed Metal, Gold Plated | SMD | |||||
Left Button PCB, Bottom | I/O & Interface | Passive | Magnetic | 2 | Inductor - Ceramic Multilayer | 1/2 Gray / White | 402 | ||||
Left Button PCB, Bottom | I/O & Interface | Passive | Resistor | 3 | SMD Flat Chip | 402 | |||||
Left Button PCB, Bottom | I/O & Interface | Passive | Resistor | 1 | SMD Flat Chip | 402 | |||||
Left Button PCB, Top | I/O & Interface | Passive | Capacitor | 5 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Left Button PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 2 | Ground Contact - Stamped / Formed Metal | SMD | |||||
Left Button PCB, Top | I/O & Interface | Optical Semi | LED | 1 | Blue, Right Angle | SMD | |||||
Left Button PCB, Top | I/O & Interface | Optical Semi | LED | 1 | Red, Right Angle | SMD | |||||
Left Button PCB, Top | I/O & Interface | Passive | Magnetic | 2 | Ferrite Bead | 402 | |||||
Left Button PCB, Top | I/O & Interface | Passive | Resistor | 5 | SMD Flat Chip | 402 | |||||
Main PCB | Mechanical / Electro-Mechanical | Electro Mechanical | PCB | 1 | UniMicron Technology | 10-Layer - FR4/RCF HDI, 1+8+1, Lead-Free, Halogen-Free | HF LF, IRS-002, >EP GW<, 1-883-949, -11, 1143 10-01, 2V 94V-0 A7, UMT-KS | ||||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Acoustics | 1 | Knowles Acoustics | SPQ2410HR5H-PD | Microphone Element - MEMS, w/ Maximum RF Protection | S582, 6073 | SMD | ||
Main PCB, Bottom | I/O & Interface | Passive | Capacitor | 95 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Main PCB, Bottom | I/O & Interface | Passive | Capacitor | 4 | Ceramic Multilayer - C0G/NP0 | Gray | 201 | ||||
Main PCB, Bottom | I/O & Interface | Passive | Capacitor | 1 | Ceramic Multilayer - C0G/NP0 | Violet | 402 | ||||
Main PCB, Bottom | I/O & Interface | Passive | Capacitor | 11 | Ceramic Multilayer - C0G/NP0 | Violet | 201 | ||||
Main PCB, Bottom | I/O & Interface | Passive | Capacitor | 26 | Ceramic Multilayer - X5R/X7R | Brown | 603 | ||||
Main PCB, Bottom | I/O & Interface | Passive | Capacitor | 51 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Ground Contact - Stamped Metal, Gold Plated | SMD | |||||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 4 | Antenna Contact - Stamped / Formed Metal, Gold Plated | SMD | |||||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Ground Contact - Stamped Metal, Gold Plated | SMD | |||||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Coaxial Receptacle - Vertical, Subminiature, Gold Plated | SMD | |||||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Hirose | FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip | HRS, J4, B1 | SMD | |||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Hirose | FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip | HRS, D1, A3 | SMD | |||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Hirose | FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip | HRS, D1, A6 | SMD | |||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip | A5 | SMD | ||||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | FFC / FPC - Right Angle, w/ Metal Housing & Locking Clip | B | SMD | ||||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Alps Electric | Memory Stick Micro (m2) Memory Card Slot - Push-Push, Right Angle, Gold Plated Contacts, w/ Metal Housing | ALPS, 11NA | SMD | |||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Hirose | Board to Board - Receptacle, Gold Plated Contacts | HRS, B | SMD | |||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Pin Header - Shrouded, Right Angle, Gold Plated Contacts | SMD | |||||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Foxconn | Mini PCI Express Card Edge - Right Angle, Gold Plated Contacts | 1BFMA, FOXCONN | SMD | |||
Main PCB, Bottom | I/O & Interface | Passive | Crystal | 1 | NDK | NX3225GA | Crystal - 27.000MHz | 27.000, Logo :138 | 2.5x3.2 SMD | ||
Main PCB, Bottom | I/O & Interface | Passive | Crystal | 1 | Epson Toyocom | FC-135 | Crystal - 32.768kHz | A140C | 1.5x3.2 SMD | ||
Main PCB, Bottom | BT / WLAN | Passive | Filter | 1 | Filter - Ceramic, Bandpass | Gray w/ Black Dot | 603 | ||||
Main PCB, Bottom | Mechanical / Electro-Mechanical | Mechanical | Hardware | 2 | Standoff - Threaded Metal | ||||||
Main PCB, Bottom | I/O & Interface | Integrated Circuit | Logic | 1 | Renesas | ASIC | C 2011, SCEI, 1141KM40L, E066D94100 (Die Marking: NEC Electronics, Corp 2009, 56, 0109) | BGA | |||
Main PCB, Bottom | I/O & Interface | Integrated Circuit | Logic | 1 | Wolfson Micro | WM1803E | Audio Codec | Logo, WM1803E, 1BAKPMN | Flip Chip | ||
Main PCB, Bottom | I/O & Interface | Integrated Circuit | Logic | Wolfson Micro | WM1803E | 1x Die - Audio Codec | D1 D1 | ||||
Main PCB, Bottom | I/O & Interface | Integrated Circuit | Logic | 1 | Toshiba Semiconductor | TC7WG126FK | Buffer - Dual, w/ 3-State Output | WG, 126 | VSSOP | Datasheet | |
Main PCB, Bottom | I/O & Interface | Integrated Circuit | Logic | 1 | Texas Instruments | TS3A5018RSVR | Analog Switch - Quad, SPDT, 10 Ohm | ZUN, 19H | QFN | Datasheet | |
Main PCB, Bottom | I/O & Interface | Integrated Circuit | Logic | 1 | IDT | Clock Synthesizer | 638, 139L, 67LG (Die Marking: 2006, 895-132, 2006, AT270, (M) IDT) | QFN | |||
Main PCB, Bottom | BT / WLAN | Passive | Magnetic | 2 | Inductor - Ceramic Multilayer | 1/2 Gray / White | 402 | ||||
Main PCB, Bottom | I/O & Interface | Passive | Magnetic | 5 | Ferrite Bead | 603 | |||||
Main PCB, Bottom | I/O & Interface | Passive | Magnetic | 8 | Ferrite Bead | 402 | |||||
Main PCB, Bottom | I/O & Interface | Passive | Magnetic | 4 | Ferrite Bead - Arrayx2 | 303 | |||||
Main PCB, Bottom | I/O & Interface | Passive | Magnetic | 1 | Ferrite Bead - Arrayx2 | 404 | |||||
Main PCB, Bottom | I/O & Interface | Integrated Circuit | MEMS | 1 | ST Microelectronics | Gyroscope - 3-Axis, Analog Output | 3GA51H, 2135, MB9DP | LGA | |||
Main PCB, Bottom | I/O & Interface | Integrated Circuit | MEMS | ST Microelectronics | Die 1 - Logic | ||||||
Main PCB, Bottom | I/O & Interface | Integrated Circuit | MEMS | ST Microelectronics | Die 2 - MEMS | Die Marking: Logo 2010, V706A | |||||
Main PCB, Bottom | I/O & Interface | Integrated Circuit | MEMS | 1 | Kionix | KXTC9 Series | Accelerometer & Inclinometer - 3-Axis, Analog Output | KXTC9, 20763, 3811 | LGA | ||
Main PCB, Bottom | I/O & Interface | Integrated Circuit | MEMS | 1 | AKM Semiconductor | AKM8975B | Electronic Compass - 3-Axis, w/ Built-In ADC, 8-Bit Digital Output & Supplementary Substrate | 8975C, D137L | Flip Chip | ||
Main PCB, Bottom | BT / WLAN | Passive | Resistor | 5 | SMD Flat Chip | 402 | |||||
Main PCB, Bottom | I/O & Interface | Passive | Resistor | 12 | SMD Flat Chip | 402 | |||||
Main PCB, Bottom | I/O & Interface | Passive | Resistor | 2 | Precision SMD | Green | 402 | ||||
Main PCB, Bottom | I/O & Interface | Passive | Resistor | 101 | SMD Flat Chip | 201 | |||||
Main PCB, Bottom | I/O & Interface | Passive | Resistor | 11 | Precision SMD | Green | 201 | ||||
Main PCB, Bottom | I/O & Interface | Passive | Resistor | 1 | SMD Flat Chip | 603 | |||||
Main PCB, Bottom | I/O & Interface | Passive | Resistor | 1 | SMD Flat Chip | 805 | |||||
Main PCB, Bottom | I/O & Interface | Passive | Resistor | 1 | Precision SMD | Blue | 402 | ||||
Main PCB, Bottom | I/O & Interface | Passive | Resonator | 1 | Ceramic Resonator | 80k | 1.3x3.2 SMD | ||||
Main PCB, Top | Power Supply | Integrated Circuit | Analog | 1 | Fujitsu | MB44C026A | Power Management Module - Contains PMIC, & Ceramic Inductors | MB44C026A, 1139 J17, E1 | BGA | ||
Main PCB, Top | Power Supply | Integrated Circuit | Analog | Fujitsu | MB44C026A | 1x Die - Power Management IC | MB44C026 | ||||
Main PCB, Top | Power Supply | Integrated Circuit | Analog | 1 | ST Microelectronics | STOD03ATPUR | DC-DC Converter - Dual, Step-Up / Inverting, 4.6V, 200mA, 1.5MHz, for Powering AMOLED Display | Y136, D03A, S | DFN | ||
Main PCB, Top | Power Supply | Integrated Circuit | Analog | 1 | Intersil | ISL9110IRTAZ | Regulator - Buck-Boost Switching, Adjustable, 1.2A, 2.5MHz | Logo, GAUA, HG5K | DFN | ||
Main PCB, Top | Power Supply | Integrated Circuit | Analog | 1 | Texas Instruments | SN99057A5 | Power Management IC | 99057, TI 19K, ARY6, G4 | QFN | ||
Main PCB, Top | Power Supply | Integrated Circuit | Analog | Texas Instruments | SN99057A5 | 1x Die - Power Management IC | SN99057A5, Logo, TI, 2010 | ||||
Main PCB, Top | Power Supply | Integrated Circuit | Analog | 1 | Texas Instruments | bq27520YZF | Battery Fuel Gauge - System-Side, w/ Integrated LDO, for Single Li-Ion Cell | TI 18A123I, SN27520S1 (Die Marking: BDQ035, M 2009) | Flip Chip | Datasheet | |
Main PCB, Top | BT / WLAN | Passive | Capacitor | 1 | Ceramic Multilayer - X5R/X7R | Brown | 805 | ||||
Main PCB, Top | BT / WLAN | Passive | Capacitor | 2 | Ceramic Multilayer - X5R/X7R | Brown | 603 | ||||
Main PCB, Top | BT / WLAN | Passive | Capacitor | 1 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Main PCB, Top | BT / WLAN | Passive | Capacitor | 4 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Main PCB, Top | Power Supply | Passive | Capacitor | 2 | Ceramic Multilayer - C0G/NP0 | Violet | 402 | ||||
Main PCB, Top | I/O & Interface | Passive | Capacitor | 1 | Ceramic Multilayer - C0G/NP0 | Violet | 201 | ||||
Main PCB, Top | I/O & Interface | Passive | Capacitor | 13 | Ceramic Multilayer - C0G/NP0 | Gray | 201 | ||||
Main PCB, Top | I/O & Interface | Passive | Capacitor | 1 | Ceramic Multilayer - X5R/X7R | Brown | 805 | ||||
Main PCB, Top | I/O & Interface | Passive | Capacitor | 2 | Ceramic Multilayer - X5R/X7R | Brown | 603 | ||||
Main PCB, Top | I/O & Interface | Passive | Capacitor | 7 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Main PCB, Top | I/O & Interface | Passive | Capacitor | 11 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Main PCB, Top | Memory | Passive | Capacitor | 4 | Ceramic Multilayer - X5R/X7R | Brown | 603 | ||||
Main PCB, Top | Memory | Passive | Capacitor | 2 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Main PCB, Top | Power Supply | Passive | Capacitor | 1 | NEC Tokin | PSLB30J476M | Tantalum Conductive Polymer - Encapsulated, 6.3V, 47uF, Low ESR | NEJ, jS7 | 594951 | Datasheet | |
Main PCB, Top | Power Supply | Passive | Capacitor | 23 | Ceramic Multilayer - X5R/X7R | Brown | 805 | ||||
Main PCB, Top | Power Supply | Passive | Capacitor | 14 | Ceramic Multilayer - X5R/X7R | Brown | 603 | ||||
Main PCB, Top | Power Supply | Passive | Capacitor | 21 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Main PCB, Top | Power Supply | Passive | Capacitor | 19 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Main PCB, Top | Power Supply | Passive | Capacitor | 1 | Ceramic Multilayer - C0G/NP0 | Gray | 201 | ||||
Main PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | FFC / FPC - Right Angle, w/ Metal Housing & Locking Clip | SMD | |||||
Main PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Ground Contact - Stamped / Formed Metal | SMD | |||||
Main PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Hirose | Board to Board - Receptacle, Gold Plated Contacts | HRS, C | SMD | |||
Main PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Jack - Micro USB, Right Angle, w/ Plastic Housing | SMD | |||||
Main PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | PS Vita Card Slot - Push-Push, Right Angle, w/ Metal Housing | A1NF | SMD | ||||
Main PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Jack - Audio, 3.5mm, Right Angle, Gold Plated Contacts in Plastic Housing | 1BCB, 3 | Thru Hole | ||||
Main PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Main I/O & Power - Right Angle, w/ Metal Housing | SMD | |||||
Main PCB, Top | Power Supply | Discrete Semi | Diode | 1 | Rohm | RB161VA-20 | Schottky Barrier - 20V, 1A | X | SOD323 | ||
Main PCB, Top | I/O & Interface | Optical Semi | LED | 1 | Amber | 402 | |||||
Main PCB, Top | I/O & Interface | Integrated Circuit | Logic | 1 | ST Microelectronics | I/O Controller | 32P10SOD, GK0MU 93, CHN 140, Logo e2 Z (Die Marking: T420A, ST 2009) | BGA | |||
Main PCB, Top | I/O & Interface | Integrated Circuit | Logic | 1 | Texas Instruments | TS3USB31RSER | USB Switch - USB 2.0, 1-Port, w/ Single Enable | L9 | QFN | ||
Main PCB, Top | Processing | Integrated Circuit | Logic | 1 | Sony | CXD5315GG | CPU - Quad-Core, ARM Cortex-A9 + 4Gb Mobile DDR2 | Sony Computer, Entertainment Inc., CXD5315GG, C 2011 SCEI, 1143HAF, 712556 | BGA | ||
Main PCB, Top | Processing | Integrated Circuit | Logic | Sony | CXD5315GG | 1x Die 2 - 1Gb Samsung GDDR5 Assumed | Die marking: 1G-E-WIDE Samsung | ||||
Main PCB, Top | Processing | Integrated Circuit | Logic | Sony | CXD5315GG | 1x Die 1 - Toshiba Logic - Core Processor Assumed | Die Marking: T9ML7, Toshiba, LP1X01) | ||||
Main PCB, Top | Processing | Integrated Circuit | Logic | Sony | CXD5315GG | 2x Die 3 - Samsung K4P2G324EC 2Gb Mobile DDR2 | (Die Marking: 200912, M, C, SAMSUNG, K4P2G324EC) | ||||
Main PCB, Top | I/O & Interface | Passive | Magnetic | 1 | Ferrite Bead - Arrayx2 | 404 | |||||
Main PCB, Top | I/O & Interface | Passive | Magnetic | 4 | Ferrite Bead | 402 | |||||
Main PCB, Top | I/O & Interface | Passive | Magnetic | 1 | Ferrite Bead | 603 | |||||
Main PCB, Top | Power Supply | Passive | Magnetic | 1 | Inductor - Wound Ferrite Core, Shielded | 2R2 | SMD | ||||
Main PCB, Top | Power Supply | Passive | Magnetic | 3 | Ferrite Bead | 1008 | |||||
Main PCB, Top | Power Supply | Passive | Magnetic | 10 | Ferrite Bead | 603 | |||||
Main PCB, Top | Processing | Passive | Magnetic | 1 | Ferrite Bead - Arrayx2 | 404 | |||||
Main PCB, Top | Processing | Passive | Magnetic | 3 | Ferrite Bead - Arrayx2 | 303 | |||||
Main PCB, Top | Processing | Passive | Magnetic | 5 | Ferrite Bead | 402 | |||||
Main PCB, Top | Memory | Integrated Circuit | Memory | 1 | Toshiba Semiconductor | THGBM3G5D1FBAIE | Flash - eMMC NAND, 4GB, MLC | TOSHIBA, THGBM3G5D1FBAIE, GT4164, TAIWAN, 11409AE | BGA | ||
Main PCB, Top | BT / WLAN | Passive | Resistor | 2 | SMD Flat Chip | 402 | |||||
Main PCB, Top | BT / WLAN | Passive | Resistor | 1 | SMD Flat Chip | 201 | |||||
Main PCB, Top | BT / WLAN | Passive | Resistor | 5 | Precision SMD | Green | 201 | ||||
Main PCB, Top | I/O & Interface | Passive | Resistor | 5 | Precision SMD | Green | 201 | ||||
Main PCB, Top | I/O & Interface | Passive | Resistor | 44 | SMD Flat Chip | 201 | |||||
Main PCB, Top | I/O & Interface | Passive | Resistor | 13 | SMD Flat Chip | 402 | |||||
Main PCB, Top | Power Supply | Passive | Resistor | 15 | SMD Flat Chip | 402 | |||||
Main PCB, Top | I/O & Interface | Passive | Resistor | 4 | SMD Flat Chip | 603 | |||||
Main PCB, Top | Memory | Passive | Resistor | 2 | SMD Flat Chip | 201 | |||||
Main PCB, Top | Power Supply | Passive | Resistor | 1 | Precision SMD | 5L00 | 1206 | ||||
Main PCB, Top | Power Supply | Passive | Resistor | 2 | SMD Flat Chip | SB | 0603 | f6502/03 2.0A | |||
Main PCB, Top | Power Supply | Passive | Resistor | 5 | Precision SMD | Green | 402 | ||||
Main PCB, Top | Power Supply | Passive | Resistor | 12 | SMD Flat Chip | 201 | |||||
Main PCB, Top | Power Supply | Passive | Resistor | 3 | Precision SMD | Green | 201 | ||||
Main PCB, Top | Processing | Passive | Resistor | 56 | SMD Flat Chip | 201 | |||||
Main PCB, Top | Processing | Passive | Resistor | 7 | Precision SMD | Green | 201 | ||||
Main PCB, Top | Processing | Passive | Resistor | 3 | Precision SMD | Green | 402 | ||||
Main PCB, Top | I/O & Interface | Passive | Resonator | 1 | Ceramic Resonator | Jk | 1.5x2 SMD | ||||
Main PCB, Top | Power Supply | Discrete Semi | Transistor | 2 | Transistor | TA | SOT363 Wide | ||||
Main PCB, Top | Power Supply | Discrete Semi | Transistor | 1 | Transistor | T4 | SOT363 Wide | ||||
Main PCB, Top | I/O & Interface | Discrete Semi | Transistor | 5 | Rohm | DTC023JM | Bipolar - NPN, 50V, 100mA, w/ Built-In Resistors | 46 | SOT723 | ||
Main PCB, Top | I/O & Interface | Discrete Semi | Transistor | 2 | Toshiba Semiconductor | SSM3J16FV | MOSFET - P-Channel, -20V, -100mA | DT | SOT723 | Datasheet | |
Main PCB, Top | I/O & Interface | Discrete Semi | Transistor | 1 | Rohm | DTA023JM | Bipolar - PNP, -50V, -100mA, w/ Built-In Resistors | 36 | SOT723 | ||
Main PCB, Top | Power Supply | Discrete Semi | Transistor | 1 | Rohm | DTA023JM | Bipolar - PNP, -50V, -100mA, w/ Built-In Resistors | 36 | SOT723 | ||
Main PCB, Top | Power Supply | Discrete Semi | Transistor | 1 | Rohm | DTC023JM | Bipolar - NPN, 50V, 100mA, w/ Built-In Resistors | 46 | SOT723 | ||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Integrated Circuit | Analog | 1 | Analog IC | 2568, 140Q | DFN | ||||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Integrated Circuit | Analog | 1 | Renesas | uPG2406T6R-E2-A | RF Switch- SPDT, L/S Band | G9 | DFN | ||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Passive | Capacitor | 1 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Passive | Capacitor | 9 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Passive | Capacitor | 5 | Ceramic Multilayer - C0G/NP0 | Violet | 201 | ||||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Passive | Capacitor | 8 | Ceramic Multilayer - C0G/NP0 | Gray | 201 | ||||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Module | Combo (BT/WiFi…) | 1 | Bluetooth / FM / WLAN Module - 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter, Contains Marvell 88W8787S-BKB2 SoC | WYSBMVDXA-1S, 1NF3 V | SMD | ||||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Passive | Crystal | 1 | Epson Toyocom | FA-128 | Crystal - 26.000MHz | 2600P, E17RA | 1.6x2 SMD | ||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Passive | Filter | 1 | Filter - Ceramic, Bandpass | Pink w/ Gray Dot | 603 | ||||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Integrated Circuit | Logic | 1 | Marvell | 88W8787S-BKB2 | Bluetooth / FM / WLAN - SoC, 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter | Logo R, 88W8787S-BKB2, PCM2170.3, 1137 B0P, TW E | BGA | ||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Integrated Circuit | Logic | 1x Die - Bluetooth / FM / WLAN - SoC, 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter | Logo 2010, MARVELL, 19C, AP0 | ||||||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Passive | Magnetic | 11 | Inductor - Ceramic Multilayer | 1/2 Gray / White | 201 | ||||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Integrated Circuit | Memory | 1 | Seiko | S-24C08CI-I8T1U3 | EEPROM - 8Kb, 2-Wire Serial | C08C, 3A7, 408 | SMD | ||
Main PCB, Top, Bluetooth / FM / WLAN Module | BT / WLAN | Passive | Resistor | 1 | SMD Flat Chip | 201 | |||||
Primary Camera Module | Camera | Camera | Camera | 1 | Primary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens | See Camera | |||||
Primary Camera Module | I/O & Interface | Passive | Capacitor | 5 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Primary Camera Module | I/O & Interface | Optical Semi | Image Sensor | 1 | OmniVision | Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area | OV2B1AG (M) | Datasheet OV7738 | |||
Right Button PCB | Mechanical / Electro-Mechanical | Electro Mechanical | PCB | 1 | Honghengsheng Electronical Technology(Huaian) | 2-Layer - FR4, Lead-Free, Halogen-Free | E253117, DS194V-0, IRR-002, 1-884-528-21, >EP GW<, LF, HF | ||||
Right Button PCB, Bottom | I/O & Interface | Passive | Capacitor | 8 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Right Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip | B6 | SMD | ||||
Right Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip | A8 | SMD | ||||
Right Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip | MXJ, A8 | SMD | ||||
Right Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 2 | Loudspeaker Contact - Stamped Metal, Gold Plated | SMD | |||||
Right Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Coaxial Receptacle - Vertical, Subminiature, Gold Plated | SMD | |||||
Right Button PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Antenna Contact - Stamped / Formed Metal, Gold Plated | SMD | |||||
Right Button PCB, Bottom | I/O & Interface | Passive | Magnetic | 1 | Inductor - Ceramic Multilayer | 1/2 Gray / White | 402 | ||||
Right Button PCB, Bottom | I/O & Interface | Passive | Resistor | 2 | SMD Flat Chip | 402 | |||||
Right Button PCB, Bottom | I/O & Interface | Passive | Resistor | 4 | SMD Flat Chip | 402 | |||||
Right Button PCB, Top | I/O & Interface | Passive | Capacitor | 3 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Right Button PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Ground Contact - Stamped / Formed Metal, Gold Plated | SMD | |||||
Right Button PCB, Top | I/O & Interface | Passive | Resistor | 4 | SMD Flat Chip | 402 | |||||
Sencondary Camera Module | Camera | Camera | Camera | 1 | Secondary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens | See Camera | |||||
Sencondary Camera Module | I/O & Interface | Passive | Capacitor | 5 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Sencondary Camera Module | I/O & Interface | Optical Semi | Image Sensor | 1 | OmniVision | Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area | OV2B1AG (M) | Datasheet OV7738 | |||
SIM Card PCB | Mechanical / Electro-Mechanical | Electro Mechanical | PCB | 1 | Honghengsheng Electronical Technology(Huaian) | 2-Layer - FR4, Lead-Free, Halogen-Free | IRC-002, 1-884-530-21, B, 11403, E253117, LF, HF, DS194V-0, >EP GW< | ||||
SIM Card PCB, Bottom | I/O & Interface | Passive | Capacitor | 1 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
SIM Card PCB, Bottom | I/O & Interface | Passive | Capacitor | 1 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
SIM Card PCB, Bottom | I/O & Interface | Passive | Capacitor | 2 | Ceramic Multilayer - C0G/NP0 | Gray | 201 | ||||
SIM Card PCB, Bottom | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip | MXJ, A6 | SMD | ||||
SIM Card PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | SIM Card - 6 Gold-Plated Contacts in Plastic Carrier, w/ Metal Housing | 1BG2 | SMD | ||||
SIM Card PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Ground Contact - Stamped Metal, Gold Plated | SMD | |||||
Touchpad Controller PCB | Mechanical / Electro-Mechanical | Electro Mechanical | PCB | 1 | 2-Layer - Flex Kapton, w/ Stiffener | Logo F, M9Z, 4 | |||||
Touchpad Controller PCB, Top | I/O & Interface | Passive | Capacitor | 3 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Touchpad Controller PCB, Top | I/O & Interface | Passive | Capacitor | 3 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Touchpad Controller PCB, Top | I/O & Interface | Passive | Capacitor | 4 | SMD Flat Chip | 201 | |||||
Touchpad Controller PCB, Top | Mechanical / Electro-Mechanical | Electro Mechanical | Connector | 1 | Hirose | Board to Board - Plug, Gold Plated Contacts | HRS, B | SMD | |||
Touchpad Controller PCB, Top | I/O & Interface | Integrated Circuit | Logic | 1 | Atmel | mXT224 | Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface | ATMEL, MXT224, C070S541, F35019.1 | BGA | Atmel maXTouch | |
Touchpad Controller PCB, Top | I/O & Interface | Integrated Circuit | Logic | Atmel | mXT224 | 1x Die - Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface | Logo, AT 25968, AVR, 2010 | ||||
Touchpad Controller PCB, Top | Mechanical / Electro-Mechanical | Mechanical | Metals | 1 | Stiffener - Stamped Metal, w/ PSA | ||||||
Touchscreen PCB | I/O & Interface | Passive | Capacitor | 3 | Ceramic Multilayer - X5R/X7R | Brown | 402 | ||||
Touchscreen PCB | I/O & Interface | Passive | Capacitor | 3 | Ceramic Multilayer - X5R/X7R | Brown | 201 | ||||
Touchscreen PCB | I/O & Interface | Passive | Resistor | 3 | SMD Flat Chip | 201 |
Disassembly / Chip analysis pictures
- PS Vita Teardown by ifixit
- Sony Playstation Vita Teardown & Product Analysis by TECHINSIGHTS
- PS Vita tiny teardown
- http://www.chipworks.com/en/technical-competitive-analysis/resources/blog/sonys-ps-vita-uses-chip-on-chip-sip-3d-but-not-3d/
Related articles
- PS4 Components page & and her PS4 Template:Components
- PS4 Motherboard Components and her Template:Motherboard Components
- Soldering/Desoldering Tips/Guides
- Glossary (list of terms for type of components/packaging)
- Reference designators (list of Class Designation Letters to use for electrical and electronic assemblies)
Tutorials
- learn by sparkfun.com: