CXD2981GB: Difference between revisions

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*Syscon pads ---> https://postimg.cc/tZKbn28z


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Revision as of 08:36, 2 July 2022

CXD2981GB (CELL BE - 65nm)

65nm variants: CXD2981AGB · CXD2981GB · CXD2989 · CXD2989AGB · CXD2989GB · CXD2990GB · CXD2990AGB

For pinout reference, see : CXD2964GB (CELL BE - 90nm)


CXD2981/89/90 (1342 pads)
Pad # Name Description
AV13 SPI_SI/BE_SPI_DO < Connected to Syscon pad N2 (BGA 200 pads layout), or pin 80 (LQFP 128 pins layout)
AV23 THERMAL_OVERLOAD/SYS_THR_ALRT > Connected to Syscon pad E9 (BGA 200 pads layout), or pin UNK (LQFP 128 pins layout) through transistor
AW13 SPI_EN/BE_SPI_CS < Connected to Syscon pad M2 (BGA 200 pads layout), or pin 83 (LQFP 128 pins layout)
AW18 HARD_RESET/BE_RESET_AND < Connected to Syscon pad P2 (BGA 200 pads layout), or pin UNK (LQFP 128 pins layout)
AY13 SPI_CLK/BE_SPI_CLK < Connected to Syscon pad N1 (BGA 200 pads layout), or pin 82 (LQFP 128 pins layout)
BA13 SPI_SO/BE_SPI_DI > Connected to Syscon pad M1 (BGA 200 pads layout), or pin 81 (LQFP 128 pins layout) through 47 resistor
BA17 ATTENTION/BE_INT < Connected to Syscon pad T2 (BGA 200 pads layout), or pin 3 (LQFP 128 pins layout)
BA19 POWER_GOOD/BE_POWGOOD < Connected to Syscon pad P1 (BGA 200 pads layout), or pin UNK (LQFP 128 pins layout)