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<div style="float:right">[[File:CXD90025G_-_pic05.jpg|200px|thumb|left|[[CXD90025G]] inside die overview]]</div> | <div style="float:right">[[File:CXD90025G_-_pic05.jpg|200px|thumb|left|[[CXD90025G]] inside die overview]]</div> | ||
[[File:Ambox_deletion.png]] This article is for educational purposes only, do not try to repeat! [[File:Ambox_deletion.png]] | [[File:Ambox_deletion.png]] This article (to be moved) is for educational purposes only, do not try to repeat! [[File:Ambox_deletion.png]] | ||
== References == | == References == | ||
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*http://www.cleanroom.byu.edu/wet_etch.phtml Wet Chemical Etching of Metals and Semiconductors | *http://www.cleanroom.byu.edu/wet_etch.phtml Wet Chemical Etching of Metals and Semiconductors | ||
== Decap a (epoxy packaged) chip, but why? == | == Decap a (epoxy packaged) chip, but why? == | ||
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*to damage (beyond repair) the chip and things around you (including you) and end up ,if lucky, in the great [[Wall_of_Shame|Wall of Shame]] or much worst (dead, blind & anosmia ...) | *to damage (beyond repair) the chip and things around you (including you) and end up ,if lucky, in the great [[Wall_of_Shame|Wall of Shame]] or much worst (dead, blind & anosmia ...) | ||
*for fun (then, use razorblade but not as you were going to tearing a part of the human scalp) | *for fun (then, use razorblade but not as you were going to tearing a part of the human scalp) | ||
*photograph for forensics purposes | *photograph for forensics purposes (with good magnificient, if you didn t get blind during the process - to look for damage or to get die numbers/check for counterfeit. | ||
*microprobing | |||
*microprobing | |||
*if somehow, you end up here for making explosive things/dispose body, it s not the right place. | *if somehow, you end up here for making explosive things/dispose body, it s not the right place. | ||
== The Strike Easy Hard Way (be blind & anosmia) == | == The Strike Easy Hard Way (be blind & anosmia) == | ||
Epoxy resin around the chip could be removed using fuming '''nitric acid''' (HNO<small>3</small>) (when the solution contains more than 86% HNO3, it is referred to as fuming nitric acid). | Epoxy resin around the chip could be removed using fuming '''nitric acid''' (HNO<small>3</small>) (when the solution contains more than 86% HNO3, it is referred to as fuming nitric acid). Hot fuming nitric acid dissolves the package without affecting the chip. The procedure should preferably be carried out under very dry conditions, as the presence of water could corrode exposed aluminium interconnects. Alternatives to heated HNO<small>3</small> (70% concentration is enough) can be with cold white HNO<small>3</small> (99% concentration), with '''sulfuric acid''' (H<small>2</small>SO<small>4</small>) or with (boilting) '''rosin''' (for 20 minutes). | ||
Hot fuming nitric acid dissolves the package without affecting the chip. The procedure should preferably be carried out under very dry conditions, as the presence of water could corrode exposed aluminium interconnects. | |||
Alternatives to heated HNO<small>3</small> (70% concentration is enough) can be with cold white HNO<small>3</small> (99% concentration), with '''sulfuric acid''' (H<small>2</small>SO<small>4</small>) or with (boilting) '''rosin''' (for 20 minutes). | |||
The chip is then washed with '''acetone''' in an '''ultrasonic bath''', followed optionally by a short bath in '''deionized water''' and '''isopropanol'''. | The chip is then washed with '''acetone''' in an '''ultrasonic bath''', followed optionally by a short bath in '''deionized water''' and '''isopropanol'''. After that chip could be glued into a test package and bonded manually. Having enough experience it might be possible to remove epoxy without destroying bonding wires and smartcard contacts. | ||
After that chip could be glued into a test package and bonded manually. Having enough experience it might be possible to remove epoxy without destroying bonding wires and smartcard contacts. | |||
On the depackaged chip, the top-layer aluminium interconnect lines are still covered by a passivation layer (usually silicon oxide or nitride), which protects the chip from the environment and ion migration. | On the depackaged chip, the top-layer aluminium interconnect lines are still covered by a passivation layer (usually silicon oxide or nitride), which protects the chip from the environment and ion migration. | ||
On top of this, we might also find a polyimide layer that was not entirely removed by HNO3 but which can be dissolved with '''ethylenediamine'''. | On top of this, we might also find a polyimide layer that was not entirely removed by HNO3 but which can be dissolved with '''ethylenediamine'''. We have to remove the passivation layer (top layer of the die) before the probes can establish contact. | ||
We have to remove the passivation layer (top layer of the die) before the probes can establish contact. | |||
Wire bonding Gold is immune to attack from the fuming acids used to etch away the mold compound of the package; copper is not. | Wire bonding Gold is immune to attack from the fuming acids used to etch away the mold compound of the package; copper is not. | ||
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An other way to remove the passivation layer is by using '''hydrofluoric acid'''. | An other way to remove the passivation layer is by using '''hydrofluoric acid'''. | ||
=== Nitric acid === | === Nitric acid === | ||
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You can burn/intoxicate by fumes (like countless of experimented and certified chemists). Chemical burn traumata with nitric acid lead to | You can burn/intoxicate by fumes (like countless of experimented and certified chemists). Chemical burn traumata with nitric acid lead to | ||
specific yellow- to brown-stained wounds with slower accumulation of eschar and slower demarcation compared with thermal burns; skins stains/coloration | specific yellow- to brown-stained wounds with slower accumulation of eschar and slower demarcation compared with thermal burns; skins stains/coloration can happens later | ||
on (8 hours) without you noiticing any traumata/burn on the spot. | |||
*Boiling point:83 °C (181 °F; 356 K) 68% solution boils at 121 °C (250 °F; 394 K) | *Boiling point:83 °C (181 °F; 356 K) 68% solution boils at 121 °C (250 °F; 394 K) | ||
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*http://chemistry.about.com/od/makechemicalsyourself/a/How-To-Make-Sulfuric-Acid-At-Home.htm / http://pyrorockets.tripod.com/ How to make concentrated sulfuric acid from a car battery | *http://chemistry.about.com/od/makechemicalsyourself/a/How-To-Make-Sulfuric-Acid-At-Home.htm / http://pyrorockets.tripod.com/ How to make concentrated sulfuric acid from a car battery | ||
*http://www.instructables.com/id/Make-Sulfuric-Acid-by-Copper-Sulfate-Electrolysis/ How to make sulfuric acid by electrolysis of copper using an inert anode | *http://www.instructables.com/id/Make-Sulfuric-Acid-by-Copper-Sulfate-Electrolysis/ How to make sulfuric acid by electrolysis of copper using an inert anode | ||
*http://www.instructables.com/id/Make-Sulfuric-acid-metabisulfiteoxidizer-method/ concentrated sulfuric acid from sodium metabisulfite, | *http://www.instructables.com/id/Make-Sulfuric-acid-metabisulfiteoxidizer-method/ concentrated sulfuric acid from sodium metabisulfite, hydrochloric acid and an oxidant such as hydrogen peroxide or nitric acid (metabisulfite/oxidizer method) | ||
=== Hydrofluoric acid === | === Hydrofluoric acid === | ||
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Because of the ability of hydrofluoric acid to penetrate tissue, poisoning can occur. Rinsing off is not enough. | Because of the ability of hydrofluoric acid to penetrate tissue, poisoning can occur. Rinsing off is not enough. | ||
Accidental exposures can go unnoticed until a day after (too late). | Accidental exposures can go unnoticed until a day after (too late). | ||
*http://en.wikipedia.org/wiki/Hydrofluoric_acid#Health_and_safety | *http://en.wikipedia.org/wiki/Hydrofluoric_acid#Health_and_safety | ||
Porcelain etch gel contain low (9.6%) concentration of Hydrofluoric acid | Porcelain etch gel contain low (9.6%) concentration of Hydrofluoric acid | ||
=== Rosin === | === Rosin === | ||
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Common Products Containing Acetone: | Common Products Containing Acetone: | ||
*Nail polish and nail polish removers | *Nail polish and nail polish removers | ||
*lot of others daily products | |||
*lot of others daily | |||
=== Isopropanol === | === Isopropanol === | ||
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[[File:Imbox content.png]] Warning: | [[File:Imbox content.png]] Warning: | ||
Ethylenediamine is a skin and respiratory irritant. Unless tightly contained, liquid ethylenediamine will release toxic | Ethylenediamine is a skin and respiratory irritant. Unless tightly contained, liquid ethylenediamine will release toxic and irritating vapors into its surroundings, | ||
especially on heating. The vapors react with moisture in humid air to form a characteristic white mist, which is extremely irritating to skin, eyes, lungs and mucus | |||
especially on heating. The vapors react with moisture in humid air to form a characteristic white mist, | membranes. Exposure to a relatively small amount of vapor or mist by inhalation can seriously damage health and may even result in death. | ||
=== Ultrasonic bath === | === Ultrasonic bath === | ||
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conventional water and exposing it to electrically charged resins that attract and bind to the salts, removing them from the water. | conventional water and exposing it to electrically charged resins that attract and bind to the salts, removing them from the water. | ||
=== | === Safety === | ||
= | |||
Most | Most if the items listed here are Prohibited Items (no fly)-hazardous materials (e.g. http://www.tsa.gov/traveler-information/prohibited-items) | ||
In most of countries, having them/making them/speaking/thinking/dreaming about them (with or without an proper license) is enough to put you in jail and being raped many time | |||
*before: no fly items - studish/read - ... | *before: no fly items - studish/read - ... | ||
*during: humble state of mind / not high/not drunk - ... | *during: humble state of mind / not high/not drunk - ... | ||
*after: storage/disposal of hazardous items, nearest clinics | *after: storage/disposal of hazardous items, nearest clinics - .... | ||
*proper workplace/labs (not your kitchen table or RV vehicle as acids can cause | *proper workplace/labs (not your kitchen table or RV vehicle as acids can cause spontaneous combustion with organics) | ||
* | *Fume Cabinet | ||
*acid-prof gloves | *acid-prof gloves | ||
*protection glasses | *protection glasses | ||
*protective suit | *protective suit | ||
... | ... | ||
---- | |||
== Others ways == | == Others ways == | ||
*the safe way: services | *the safe way: services | ||
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*the burning way: propane or butane torch (no wires remaining) | *the burning way: propane or butane torch (no wires remaining) | ||
*the Indian way: razzorblade (e.g. [http://www.psdevwiki.com/ps3/File:RSX_die_-_Image_made_by_H%C3%A9ctor_Mart%C3%ADn.jpg RSX die], scraped with razorblade by '''Héctor Martín''' aka '''Marcan''') | *the Indian way: razzorblade (e.g. [http://www.psdevwiki.com/ps3/File:RSX_die_-_Image_made_by_H%C3%A9ctor_Mart%C3%ADn.jpg RSX die], scraped with razorblade by '''Héctor Martín''' aka '''Marcan''') | ||
*the laser way: https://www.youtube.com/watch?v=J00BEGsqIZE | |||
*the laser way: | |||
*the portal way: http://www.nordson.com/en-us/divisions/march/support/Literature/Documents/Nordson-MARCH-Mold-Decap-Article-USTech-July2012.pdf vacuum plasma | *the portal way: http://www.nordson.com/en-us/divisions/march/support/Literature/Documents/Nordson-MARCH-Mold-Decap-Article-USTech-July2012.pdf vacuum plasma | ||
*the brute force: way https://www.youtube.com/watch?v=tjjIyJxqOqE brute force (several people apparently insist that this is not decapping but just destroying) | *the brute force: way https://www.youtube.com/watch?v=tjjIyJxqOqE brute force (several people apparently insist that this is not decapping but just destroying) | ||
... | ... | ||