User:Ada L0ve Lace: Difference between revisions
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*http://www.hpl.hp.com/research/ptm/ Polynomial Texture Maps | *http://www.hpl.hp.com/research/ptm/ Polynomial Texture Maps | ||
*http://www.cl.cam.ac.uk/~sps32/ Dr Sergei Skorobogatov - University of Cambridge | *http://www.cl.cam.ac.uk/~sps32/ Dr Sergei Skorobogatov - University of Cambridge | ||
*http://home.deib.polimi.it/barenghi/doku.php?id=publist Alessandro Barenghi - Politecnico di Milano | *http://home.deib.polimi.it/barenghi/doku.php?id=publist Alessandro Barenghi - Politecnico di Milano | ||
*https://www.youtube.com/watch?v=Ps8jOj7diA0 Programming Paradigms (Stanford) | *https://www.youtube.com/watch?v=Ps8jOj7diA0 Programming Paradigms (Stanford) | ||
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=== Decap === | === Decap === | ||
*http://www.cl.cam.ac.uk/~sps32/mcu_lock.html Copy Protection in Modern Microcontrollers - Dr Sergei Skorobogatov (to be moved on later to decap page/section) | |||
Epoxy resin around the chip could be removed using fuming nitric acid. Hot fuming nitric acid dissolves the package without affecting the chip. The procedure should preferably be carried out under very dry conditions, as the presence of water could corrode exposed aluminium interconnects. The chip is then washed with acetone in an ultrasonic bath, followed optionally by a short bath in deionized water and isopropanol. After that chip could be glued into a test package and bonded manually. Having enough experience it might be possible to remove epoxy without destroying bonding wires and smartcard contacts. | Epoxy resin around the chip could be removed using fuming nitric acid. Hot fuming nitric acid dissolves the package without affecting the chip. The procedure should preferably be carried out under very dry conditions, as the presence of water could corrode exposed aluminium interconnects. The chip is then washed with acetone in an ultrasonic bath, followed optionally by a short bath in deionized water and isopropanol. After that chip could be glued into a test package and bonded manually. Having enough experience it might be possible to remove epoxy without destroying bonding wires and smartcard contacts. | ||
Revision as of 02:27, 6 April 2015
Messageboard
put your user to user message in this section :)
Dear Ada,
Traitor!
the end.
I'll be back! in few weeks months.--Ada L0ve Lace (talk) 10:32, 26 February 2015 (EST)
22 March 2015 Barcelona vs Real Madrid
- 2-1 - meuuuuuussi
Notes:
- Matyrant, Seussarez, Adanaldo scored (and get false positive offside on his assist), Meussi just no.
Real notes: Meussi did the assist on the 1st goal and Meussi is the leader. Meussi 1-0 Adanaldo
cya next time for another clasico!
Ctyriano Adanaldo 36 Meussi 32 i saw it live today 9-1
- you went to Madrid? to watch Adanaldo? if so, you are traitor and became Adanaldo fan
Notebook
- http://www.hpl.hp.com/research/ptm/ Polynomial Texture Maps
- http://www.cl.cam.ac.uk/~sps32/ Dr Sergei Skorobogatov - University of Cambridge
- http://home.deib.polimi.it/barenghi/doku.php?id=publist Alessandro Barenghi - Politecnico di Milano
- https://www.youtube.com/watch?v=Ps8jOj7diA0 Programming Paradigms (Stanford)
- http://epublications.uef.fi/pub/urn_isbn_978-951-27-0111-7/urn_isbn_978-951-27-0111-7.pdf Security Threats and Countermeasures in Bluetooth-Enabled Systems (Doctoral dissertation - University of Kuopio, Finland)
- http://www.curtain-damashii.com/index_ag/game/meruru/
ToDo
Decap
- http://www.cl.cam.ac.uk/~sps32/mcu_lock.html Copy Protection in Modern Microcontrollers - Dr Sergei Skorobogatov (to be moved on later to decap page/section)
Epoxy resin around the chip could be removed using fuming nitric acid. Hot fuming nitric acid dissolves the package without affecting the chip. The procedure should preferably be carried out under very dry conditions, as the presence of water could corrode exposed aluminium interconnects. The chip is then washed with acetone in an ultrasonic bath, followed optionally by a short bath in deionized water and isopropanol. After that chip could be glued into a test package and bonded manually. Having enough experience it might be possible to remove epoxy without destroying bonding wires and smartcard contacts.
On the depackaged chip, the top-layer aluminium interconnect lines are still covered by a passivation layer (usually silicon oxide or nitride), which protects the chip from the environment and ion migration. On top of this, we might also find a polyimide layer that was not entirely removed by HNO3 but which can be dissolved with ethylendiamine. We have to remove the passivation layer before the probes can establish contact. The most convenient depassivation technique is the use of a laser cutter. The UV or green laser is mounted on the camera port of the microscope and fires laser pulses through the microscope onto rectangular areas of the chip with micrometer precision. Carefully dosed laser flashes remove patches of the passivation layer. The resulting hole in the passivation layer can be made so small that only a single bus line is exposed. This prevents accidental contacts with neighboring lines and the hole also stabilizes the position of the probe and makes it less sensitive to vibrations and temperature changes.
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