CELL BE: Difference between revisions
(Change CECH-42xx CELL Serial from CXD2996BGB to CXD2999AGG) |
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<div style="float:right">[[File:CXD2992AGB 46J2494 diemrk1.jpg|x300px|thumb|left|IBM markings in CXD2992AGB die]][[File:CellBE.jpg|x300px|thumb|right|Cell Broadband Engine<br />CPU with heatplate<br />CXD2992AGB]]</div> | |||
= Cell Broadband Engine = | = Cell Broadband Engine = | ||
The Cell CPU has one 3.2Ghz PPE (Power Processor Element) with two threads and eight 3.2Ghz SPE (Synergistic Processing Elements). | The Cell CPU has one 3.2Ghz PPE (Power Processor Element) with two threads and eight 3.2Ghz SPE (Synergistic Processing Elements). | ||
The PPE is a general purpose CPU, while the eight SPE are geared towards processing data in parallel. One SPE is disabled to increase yield, so the PS3 can have at most 9 threads | The PPE is a general purpose CPU, while the eight SPE are geared towards processing data in parallel. One SPE is disabled to increase yield, so the PS3 can have at most 9 threads running at the same time (2 from PPE and 7 from SPE). Note that one SPE is reserved for the hypervisor, so PS3 programs can take advantage of 8 threads. Both the PPE and SPE of the Cell are 64 bit, and manipulate data in Big Endian. | ||
== Specifications == | == Specifications == | ||
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== Die explained == | == Die explained == | ||
< | <gallery> | ||
File:CELLBE die large.jpg|Cell Broadband Engine<br />Die - 90nm | |||
File:SPU-DIE.PNG|Cell Broadband Engine<br />SPU Die map | |||
File:CellBE-map-90nm.jpg|Cell Broadband Engine<br />Die map - 90nm | |||
File:CellBE-map-65nm.jpg|Cell Broadband Engine<br />Die map - 65nm | |||
File:CellBE-map-45nm.jpg|Cell Broadband Engine<br />Die map - 45nm | |||
</ | File:Cell-90nm-die.png|Cell Broadband Engine<br />Die map - 90nm | ||
File:SPU-diagram-DMA.png|Cell Broadband Engine<br />SPU diagram | |||
</gallery> | |||
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" | {| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" | ||
|- bgcolor="#cccccc" | |- bgcolor="#cccccc" | ||
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=== SPE === | === SPE === | ||
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" | {| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" | ||
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Reference: http://hpc.pnl.gov/people/fabrizio/papers/ieeemicro-cell.pdf // backup/mirror: [http://www.multiupload.com/UN7VJHHER1 ieeemicro-cell.pdf (222.51 KB)] | Reference: http://hpc.pnl.gov/people/fabrizio/papers/ieeemicro-cell.pdf // backup/mirror: [http://www.multiupload.com/UN7VJHHER1 ieeemicro-cell.pdf (222.51 KB)] | ||
== | == Bandwidth I/O == | ||
<div style="float:right">[[File:Cellbe-bandwith.gif|200px|thumb|left|CellBE bandwidth]]</div> | <div style="float:right">[[File:Cellbe-bandwith.gif|200px|thumb|left|CellBE bandwidth]]</div> | ||
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Reference: [http://www.ibm.com/developerworks/power/library/pa-cellperf/ Cell Broadband Engine Architecture and its first implementation - A performance view] | Reference: [http://www.ibm.com/developerworks/power/library/pa-cellperf/ Cell Broadband Engine Architecture and its first implementation - A performance view] | ||
== Types @ SKU == | |||
<gallery> | |||
File:Cell-BE-90nm.jpg|[[CELL BE]] 90nm | |||
File:Cell-BE-65nm.jpg|[[CELL BE]] 65nm | |||
File:Cell-BE-45nm.jpg|[[CELL BE]] 45nm | |||
</gallery> | |||
'''Note:''' All Cell BE packages measures 42.5mm × 42.5mm | |||
The Cell BE was introduced at 90nm. Later, PS3 model numbers starting with CECHG uses the 65nm version, while the PS3 Slim (CECH-20xx) used the 45nm version (See [[SKU Models]] and table below). | The Cell BE was introduced at 90nm. Later, PS3 model numbers starting with CECHG uses the 65nm version, while the PS3 Slim (CECH-20xx) used the 45nm version (See [[SKU Models]] and table below). | ||
A sampling of the | A sampling of the CELL/B.E. types by model number: | ||
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" | {| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" | ||
|- bgcolor="#cccccc" | |- bgcolor="#cccccc" | ||
! PS3 Model !! Mobo Model !! Mobo | ! PS3 Model !! Mobo Model !! Mobo part number !! CELL type !! Die process !! Total Die Size !! Width x Length !! SPU size !! PPE Size !! Remark | ||
|- | |- | ||
| [[CECHAxx]] || [[COK-00x#COK-001|COK-001]] || - || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | | [[CECHAxx]] || [[COK-00x#COK-001|COK-001]] || - || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | ||
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|- | |- | ||
| [[CECHCxx]] || [[COK-00x#COK-002|COK-002]] || 1-873-513-21<br />1-873-513-31 || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | | [[CECHCxx]] || [[COK-00x#COK-002|COK-002]] || 1-873-513-21<br />1-873-513-31 || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | ||
|- | |- | ||
| [[CECHExx]] || [[COK-00x#COK-002W|COK-002W]] || - || CXD29?? || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | | [[CECHExx]] || [[COK-00x#COK-002W|COK-002W]] || - || CXD29?? || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | ||
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|- | |- | ||
| [[CECHExx]] || [[COK-00x#COK-002W|COK-002W]] || 1-873-513-31 || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es] | | [[CECHExx]] || [[COK-00x#COK-002W|COK-002W]] || 1-873-513-31 || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es] | ||
|- | |- | ||
| [[CECHGxx]] || [[SEM-00x|SEM-001]] || 1-875-384-11<br />1-875-384-21<br />1-875-384-31 || [[CXD2981AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | | [[CECHGxx]] || [[SEM-00x|SEM-001]] || 1-875-384-11<br />1-875-384-21<br />1-875-384-31 || [[CXD2981AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | ||
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| [[CECHHxx]] || [[DIA-00x#DIA-001|DIA-001]] || 1-875-938-31 || [[CXD2981AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es] | | [[CECHHxx]] || [[DIA-00x#DIA-001|DIA-001]] || 1-875-938-31 || [[CXD2981AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es] | ||
|- | |- | ||
| | | [[CECHJxx]] || [[DIA-00x#DIA-002|DIA-002]] || 1-876-912-31 || [[CXD2989GB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | ||
|- | |- | ||
| [[ | | [[CECHKxx]] || [[DIA-00x#DIA-002|DIA-002]] || 1-876-912-32 || [[CXD2989AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | ||
|- | |- | ||
| [[CECHKxx]] || [[DIA-00x#DIA-002|DIA-002]] || 1-876-912-32 || [[ | | [[CECHKxx]] || [[DIA-00x#DIA-002|DIA-002]] || 1-876-912-32 || [[CXD2990GB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || | ||
|- | |- | ||
| [[CECHLxx]] || [[VER-00x|VER-001]] || - || [[CXD2990AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | | [[CECHLxx]] || [[VER-00x|VER-001]] || - || [[CXD2990AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | ||
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| [[CECHMxx]] || [[VER-00x|VER-001]] || ?1-878-196-41? || -? || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || -? | | [[CECHMxx]] || [[VER-00x|VER-001]] || ?1-878-196-41? || -? || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || -? | ||
|- | |- | ||
| [[CECHPxx]] || [[VER-00x|VER-001]] || 1-878-196-31 || [[CXD2990AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || -? | |||
| [[CECHPxx]] || [[VER-00x|VER-001]] || | |||
|- | |- | ||
| [[CECHQxx]] || [[VER-00x|VER-001]] || ?1-878-196-41? || CXD299? || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | | [[CECHQxx]] || [[VER-00x|VER-001]] || ?1-878-196-41? || CXD299? || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | ||
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|- | |- | ||
| [[CECH-21xx]] || [[SUR-00x|SUR-001]] || 1-881-945-11 || [[CXD2992AGB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es] | | [[CECH-21xx]] || [[SUR-00x|SUR-001]] || 1-881-945-11 || [[CXD2992AGB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es] | ||
|- | |||
| [[CECH-25xx]] || [[JTP-00x|JTP-001]] || 1-882-481-21 || [[CXD2992GB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || | |||
|- | |- | ||
| [[CECH-25xx]] || [[JTP-00x|JTP-001]] || 1-882-481-31 || [[CXD2992GB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | | [[CECH-25xx]] || [[JTP-00x|JTP-001]] || 1-882-481-31 || [[CXD2992GB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets] | ||
|- | |- | ||
| [[CECH-25xx]] || [[JSD-00x|JSD-001]] || 1-882- | | [[CECH-25xx]] || [[JSD-00x|JSD-001]] || 1-882-770-11 || [[CXD2992BGB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || <!-- with IHS plastic spacer--> | ||
|- | |||
| [[CECH-25xx]] || [[JSD-00x|JSD-001]] || 1-882-770-21 || [[CXD2992GB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || <!-- without IHS plastic spacer--> | |||
|- | |- | ||
| [[CECH-30xx]] || [[KTE-00x|KTE-001]] || 1-884-749-11 || [[CXD2996GB]]? || 45nm? || 115.46mm²? || 12.75mm x 9.06mm? || 6.47mm²? || 11.32mm²? || -? | | [[CECH-30xx]] || [[KTE-00x|KTE-001]] || 1-884-749-11 || [[CXD2996GB]]? || 45nm? || 115.46mm²? || 12.75mm x 9.06mm? || 6.47mm²? || 11.32mm²? || -? | ||
|- | |- | ||
| [[CECH-40xx]] || [[MSX-00x|MSX-001]] || 1-886-928-11 || [[CXD2996BGB]] || 45nm? || 115.46mm²? || 12.75mm x 9.06mm? || 6.47mm²? || 11.32mm²? || - | | [[CECH-30xx]] || [[KTE-00x|KTE-001]] || 1-884-749-31 || [[CXD2996GB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || | ||
|- | |||
| [[CECH-40xx]] || [[MSX-00x|MSX-001]] || 1-886-928-11 || [[CXD2996BGB]] || 45nm? || 115.46mm²? || 12.75mm x 9.06mm? || 6.47mm²? || 11.32mm²? || [https://www.techrepublic.com/pictures/cracking-open-the-playstation-3-super-slim/ techrepublic] | |||
|- | |- | ||
| [[CECH-40xx]] || [[MPX-00x|MPX-001]] || 1-887-233-11 || [[CXD2996BGB]] || 45nm? || 115.46mm²? || 12.75mm x 9.06mm? || 6.47mm²? || 11.32mm²? || -? | | [[CECH-40xx]] || [[MPX-00x|MPX-001]] || 1-887-233-11 || [[CXD2996BGB]] || 45nm? || 115.46mm²? || 12.75mm x 9.06mm? || 6.47mm²? || 11.32mm²? || -? | ||
|- | |- | ||
| [[CECH-42xx]] || [[PQX-00x|PQX-001]] || 1-888-629-22 || [[CXD2999AGG]] || ?nm || ?mm² || ?mm x ?mm || ?mm² || ?mm² || [http://www.mobile01.com/topicdetail.php?f=281&t=3747667&p=1 mobile01_tw] | | ? || [[NPX-00x|NPX-001]] || ? || ? || 45nm? || 115.46mm²? || 12.75mm x 9.06mm? || 6.47mm²? || 11.32mm²? || -? | ||
|- | |||
| ? || [[PPX-00x|PPX-001]] || ? || ? || ?nm (smaller ?) || ?mm² || ?mm x ?mm || ?mm² || ?mm² || | |||
|- | |||
| [[CECH-42xx]] || [[PQX-00x|PQX-001]] || 1-888-629-22 || [[CXD2999AGG]] || ?nm (smaller ?) || ?mm² || ?mm x ?mm || ?mm² || ?mm² || [http://www.mobile01.com/topicdetail.php?f=281&t=3747667&p=1 mobile01_tw] | |||
|- | |||
| ? || [[RTX-00x|RTX-001]] || ? || ? || ?nm (smaller ?) || ?mm² || ?mm x ?mm || ?mm² || ?mm² || | |||
|- | |||
| [[CECH-43xx]] || [[REX-00x|REX-001]] || 1-893-507-31 || [[CXD2999AGG]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || ?mm² || ?mm² || Identical die size despite smaller case. Die (sometimes?) glued/soldered to IHS! Do not delid! | |||
|- | |- | ||
|} | |} | ||
===Alternative | |||
* [[CECHAxx]]/[[COK-00x#COK-001|COK-001]], [[ | ===Alternative list=== | ||
* [[ | *[[Template:CELL pad layout 90nm]] (41x41)-(19x19)-84 = 1681-361-84 = '''1236 pads''' | ||
* [[CECHJxx]]/[[DIA-00x#DIA-002|DIA-002]] | ** '''CXD2964 series''' | ||
* [[CECHLxx]]/[[VER-00x|VER-001]] | *** [[CXD2964GB]], found in [[CECHAxx]]/[[COK-00x#COK-001|COK-001]] | ||
* [[CECH-20xx]]/[[DYN-00x|DYN-001]], [[CECH-21xx]]/[[SUR-00x|SUR-001]], [[CECH-25xx]]/[[JTP-00x|JTP-001]] and [[CECH-25xx]]/[[ | *** [[CXD2964AGB]], found in: [[CECHAxx]]/[[COK-00x#COK-001|COK-001]], [[CECHBxx]]/[[COK-00x#COK-001|COK-001]] and [[CECHCxx]]/[[COK-00x#COK-002|COK-002]] | ||
*** CXD2964BGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB" | |||
* [[CECH- | *[[Template:CELL pad layout 65nm]] (41x41)-(15x17)-84 = 1681-255-84 = '''1342 pads''' | ||
* [[CECH-42xx]]/[[PQX-00x|PQX-001]] | ** '''CXD2981 series''' | ||
*** [[CXD2981GB]], found in: [[CECHHxx]]/[[DIA-00x|DIA-001]] | |||
*** [[CXD2981AGB]], found in: [[CECHHxx]]/[[DIA-00x#DIA-001|DIA-001]] and [[CECHGxx]]/[[SEM-00x|SEM-001]] | |||
*** CXD2981BGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB" | |||
*** CXD2981CGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB" | |||
** '''CXD2989 series''' | |||
*** [[CXD2989GB]], found in: [[CECHJxx]]/[[DIA-00x#DIA-002|DIA-002]] | |||
*** [[CXD2989AGB]], found in: [[CECHKxx]]/[[DIA-00x#DIA-002|DIA-002]] | |||
*** CXD2989BGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB" | |||
** '''CXD2990 series''' | |||
*** [[CXD2990GB]], found in: [[CECHLxx]]/[[VER-00x|VER-001]] | |||
*** [[CXD2990AGB]], found in: [[CECHLxx]]/[[VER-00x|VER-001]] | |||
*** CXD2990BGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB" | |||
*** Also in [[DECR-1400]]/[[DEB-001]] ? | |||
*[[Template:CELL pad layout 45nm v1]] (41x41)-(17x17)-84 = 1681-289-84 = '''1308 pads''' | |||
** '''CXD2992 series''' | |||
*** [[CXD2992GB]], found in: [[CECH-25xx]]/[[JTP-00x|JTP-001]] and [[CECH-25xx]]/[[JSD-00x|JSD-001]] (without the black plastic spacer in between the IHS and the substrate. Standard thermal paste in the DIE) | |||
*** [[CXD2992AGB]], found in: [[CECH-20xx]]/[[DYN-00x|DYN-001]], [[CECH-21xx]]/[[SUR-00x|SUR-001]] | |||
*** [[CXD2992BGB]], found in: [[CECH-25xx]]/[[JTP-00x|JTP-001]] and [[CECH-25xx]]/[[JSD-00x|JSD-001]] ('''with''' the black plastic spacer in between the IHS and the substrate. Posible '''thermal adhesive''' in the DIE) | |||
*** CXD2992CGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB" | |||
** '''CXD2996 series''' | |||
*** [[CXD2996GB]], found in: [[CECH-30xx]]/[[KTE-00x|KTE-001]] and [[CECH-40xx]]/[[MSX-00x|MSX-001]] | |||
*** CXD2996AGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB" | |||
*** [[CXD2996BGB]], found in: [[CECH-30xx]]/[[KTE-00x|KTE-001]] and [[CECH-40xx]]/[[MPX-00x|MPX-001]] ('''with''' the black plastic spacer in between the IHS and the substrate. Posible '''thermal adhesive''' in the DIE) | |||
*** CXD2996CGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB" | |||
*[[Template:CELL pad layout 45nm v2]] (42x42)-(22x18)-9 = 1764-396-9 = '''1359 pads''' | |||
** '''CXD2999 series (45 nm ?)''' | |||
*** CXD2999GG, never reported to wiki but google knows it, belongs to the same series with the suffix "GG" -> "AGG" -> "BGG" | |||
*** [[CXD2999AGG]], found in: [[CECH-42xx]]/[[PQX-00x|PQX-001]] | |||
*** CXD2999BGG, never reported to wiki but google knows it, belongs to the same series with the suffix "GG" -> "AGG" -> "BGG" | |||
<br /> | <br /> | ||
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=== Cell Revisions === | === Cell Revisions === | ||
{|class="wikitable" | |||
|- | |||
! Low word of BP_VR !! Revision !! Name | |||
|- | |||
| 0x0000 || 0x010 || 90 nm DD 1.0 | |||
|- | |||
| 0x0001 || 0x011 || 90 nm DD 1.1 | |||
|- | |||
| 0x0002 || 0x012 || 90 nm DD 1.2 | |||
|- | |||
| 0x0100 || 0x020 || 90 nm DD 2.0 | |||
|- | |||
| 0x0200 || 0x030 || 90 nm DD 3.0 | |||
|- | |||
| 0x0201 || 0x031 || 90 nm DD 3.1 | |||
|- | |||
| 0x0202 || 0x032 || 90 nm DD 3.2 | |||
|- | |||
| 0x1000 || 0x110 || 65 nm DD 1.0 | |||
|- | |||
| 0x2000 || 0x210 || 45 nm DD 1.0 | |||
|- | |||
| 0x2100 || 0x220 || 45 nm DD 2.0 | |||
|} | |||
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable sortable" style="border:1px solid #999; border-collapse: collapse;" | {| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable sortable" style="border:1px solid #999; border-collapse: collapse;" | ||
|- bgcolor="#cccccc" | |- bgcolor="#cccccc" | ||
! CellBE Version !! PVR !! Speed | ! CellBE Version !! PVR !! Speed || SKU | ||
|- | |||
| Cell/BE v1.0 || 0x0070 0x0100 || 2.4GHz || [[CEB-1020]] | |||
|- | |||
| Cell/BE v2.0 || 0x0070 0x0400 || 2.4GHz || [[CEB-2030]], [[CEB-2040]] | |||
|- | |- | ||
| Cell/BE | | Cell/BE v3.0 || 0x0070 0x0500 || 3.2GHz || [[CEB-2050]] | ||
|- | |- | ||
| Cell/BE | | Cell/BE v3.1 || 0x0070 0x0501 || 3.2GHz || [[CEB-9000]] | ||
|- | |- | ||
| Cell/BE v3. | | Cell/BE v3.2 || 0x0070 0x0501 || 3.2GHz || | ||
|- | |- | ||
| | | ???? || 0x0070 0x2100 || || | ||
|- | |- | ||
| | | 11S DD1.0 || ???? || ???? || [[VER-001]] | ||
|- | |- | ||
| ???? || | | 12S DD2.0 || ???? || ???? || [[KTE-001]] | ||
|- | |- | ||
|} | |} | ||
== Unsorted == | == Unsorted == | ||
=== Cell Integrated Heat Spreader (IHS) WARNING === | |||
Starting with PS3 Slim models CECH-25xx some of the CELL Integrated Heat Spreaders are secured to the CELL processor die with thermal adhesive. Cell processor models with a thinner substrate and black plastic spacer in between the IHS and the substrate may be glued. Removing an IHS that is glued to the Cell will destroy the Cell CPU. | |||
=== Integrated Heat Spreader (IHS) removed pic's === | === Integrated Heat Spreader (IHS) removed pic's === | ||
* when it goes OK: http://imageshack.us/f/855/imgp0048v.jpg/ http://imageshack.us/f/850/imgp0046i.jpg/ | * when it goes OK: | ||
** http://imageshack.us/f/855/imgp0048v.jpg/ http://imageshack.us/f/850/imgp0046i.jpg/ | |||
** http://www.testhome.de/Austin316/files/Bilder/ps3/Cell_IHS_1.jpg http://www.testhome.de/Austin316/files/Bilder/ps3/Cell_IHS_2.jpg http://www.testhome.de/Austin316/files/Bilder/ps3/Cell_IHS_3.jpg | |||
* when it goes wrong: http://postimage.org/image/hl11y3969/full/ http://postimage.org/image/bbydh5s6v/full/ | * when it goes wrong: | ||
** http://postimage.org/image/hl11y3969/full/ http://postimage.org/image/bbydh5s6v/full/ | |||
=== IHS size and mounting === | === IHS size and mounting === | ||
Line 293: | Line 369: | ||
although a PC cooler should fit within these dimensions fine, mounting the 2 (which are also elevated differently from the motherboard) can be problematic | although a PC cooler should fit within these dimensions fine, mounting the 2 (which are also elevated differently from the motherboard) can be problematic | ||
=== IHSBuster tool === | |||
<gallery> | |||
File:IHSBuster-pic0.png|[[CELL BE]] IHSBuster - pic0 | |||
File:IHSBuster-pic1.png|[[CELL BE]] IHSBuster - pic1 | |||
File:IHSBuster-pic2.png|[[CELL BE]] IHSBuster - pic2 | |||
File:IHSBuster-pic3.png|[[CELL BE]] IHSBuster - pic3 | |||
</gallery> | |||
{{Motherboard Components}}<noinclude>[[Category:Main]]</noinclude> | {{Motherboard Components}}<noinclude>[[Category:Main]]</noinclude> |
Latest revision as of 03:17, 2 May 2023
Cell Broadband Engine[edit | edit source]
The Cell CPU has one 3.2Ghz PPE (Power Processor Element) with two threads and eight 3.2Ghz SPE (Synergistic Processing Elements).
The PPE is a general purpose CPU, while the eight SPE are geared towards processing data in parallel. One SPE is disabled to increase yield, so the PS3 can have at most 9 threads running at the same time (2 from PPE and 7 from SPE). Note that one SPE is reserved for the hypervisor, so PS3 programs can take advantage of 8 threads. Both the PPE and SPE of the Cell are 64 bit, and manipulate data in Big Endian.
Specifications[edit | edit source]
- 1 PPE (Power Processor Element)
- 3.2Ghz
- 64 bit, Big Endian
- 2 threads (can run at same time)
- L1 cache: 32kB data + 32kB instruction
- L2 cache: 512kB
- Memory bus width: 64bit (serial)
- VMX (Altivec) instruction set support
- Full IEEE-754 compliant
- the PPU can execute two double precision or eight single precision operations per clockcycle
- 8 SPE (Synergistic Processing Element)
- 3.2Ghz
- 64 bit, Big Endian
- 1 SPE disabled to improve chip yield (see: Unlocking the 8th SPE)
- 1 SPE dedicated for hypervisor security
- 256KB local store per SPE
- 128 registers per SPE
- Dual Issue (Each SPE can execute 2 instructions per clock)
- IEEE-754 compliant in double precision (single precision round-towards-zero instead of round-towards-even)
There is a lot of info about CELL/BE on the Cell Programming IBM page.
Die explained[edit | edit source]
ABBR | Usage | Speed | Notes |
---|---|---|---|
BEI | Broadband engine interface | 1.6GHz (NCLK/2) | I/O Controller to FlexIO(/RSX) |
EIB | Element interconnect bus | 1.6GHz (NCLK/2) | used as communication ring for the 8 SPE (and PPU + MIC + BEI) |
FlexIO | High-speed I/O interface | 2.5Ghz (RC_REFCLK : 500MHz 1:5 PLL) | Flex I/O to RSX |
L2 | Level 2 cache | 3.2GHz (NCLK) | 512KB L2 cache for PPE |
MIC | Memory interface controller | 1.6GHz (NCLK/2) | Memory controller to XIO(/Rambus XDR) |
MBL | MIC bus logic | 1.6GHz (NCLK/2) | From MIC(/PPE) to EIB(/SPE's) |
PPE | Power processor element | 3.2GHz (NCLK) | Main dualthreaded CPU |
SPE | Synergistic processor element | 3.2GHz/1.6GHz | 8 present, 1 disabled from factory |
XIO | Extreme data rate I/O cell | 1.6GHz (Y0_RQ_CTM/Y1_RQ_CTM : 400MHz 1:4 PLL) | Rambus XDR Interface |
TEST | Test control unit (TCU) / pervasive logic (PRV) | Used for power management, thermal management, clock control, software-performance monitoring, trace analysis, preboot (and secureboot?), also has RAS-unit (Reliability, Availability, Serviceability), JTAG (IEEE 1149 test access port) and SPI Serial Peripheral Interface | |
PLL | Phase-Locked Loop | 400MHz | Before preboot external clock (400MHz) is used (see Timebases) afterwards only internal PLL (PLL_REFCLK : 400MHz 1:8 PLL) for main clocks: NCLK=3.2GHz, NCLK/2=1.6GHz, MiClk=1.6GHz, XIO Clk=1.6GHz, BClk=1.667GHz, RO/TO Clk=2.5GHz |
SPE[edit | edit source]
ABBR | Usage | Speed | Notes |
---|---|---|---|
BIU | Bus interface unit | 1.6GHz (NCLK/2) | connects DMAC+EIB and LS+EIB |
DMAC | Direct memory access controller | 1.6GHz (NCLK/2) | controls DMA, SPU+LS and BIU(/EIB) |
EIB | Element interconnect bus | 1.6GHz (NCLK/2) | busring to which all SPE's are connected (and PPU + MIC + BEI) |
LS | Local store | 3.2GHz (NCLK) | 256KB of local memory, accessable via DMA/MBOX |
MFC | Memory flow controller | 1.6GHz (NCLK/2) | |
MIC | Memory interface controller | 1.6GHz (NCLK/2) | Memory controller to XIO(/Rambus XDR) |
MMIO | Memory-mapped I/O | 1.6GHz (NCLK/2) | |
MMU | Memory management unit | 1.6GHz (NCLK/2) | used by DMAC for management |
SPU | Synergistic processor unit | 3.2GHz (NCLK) | SPU execution unit |
TLB | Translation lookaside buffer | 1.6GHz (NCLK/2) | used by MMU as buffer |
Reference: http://hpc.pnl.gov/people/fabrizio/papers/ieeemicro-cell.pdf // backup/mirror: ieeemicro-cell.pdf (222.51 KB)
Bandwidth I/O[edit | edit source]
- MIC (Memory Interface Controller) <from/to> dual Rambus XDR: 25.6GB/s theoretical
- IOIF0 (I/O Interface to RSX): 20GB/s to> RSX / 15 GB/s < RSX (RSX <from/to> GDDR3: 20.8GB/s @ 650MHz)
- IOIF1 (I/O Interface to Southbridge): <from/to> South Bridge : 2.5GB/s
- EIB (Element Interconnect Bus) : 4x 128bit buses / 128byte packets : 204.8 GB/s total
- PPU (PowerPC Processing Element) : 25.6 GLOP/s FPU, L1/L2: 51.2GB/s
- LHS (Load Hit Store) pipeline stall : ~40 clockcycles
- SPE (Synergistic Processor Elements) : 2 IPC SPU to Local Store : 51.2GB/s
Reference: Cell Broadband Engine Architecture and its first implementation - A performance view
Types @ SKU[edit | edit source]
Note: All Cell BE packages measures 42.5mm × 42.5mm
The Cell BE was introduced at 90nm. Later, PS3 model numbers starting with CECHG uses the 65nm version, while the PS3 Slim (CECH-20xx) used the 45nm version (See SKU Models and table below).
A sampling of the CELL/B.E. types by model number:
PS3 Model | Mobo Model | Mobo part number | CELL type | Die process | Total Die Size | Width x Length | SPU size | PPE Size | Remark |
---|---|---|---|---|---|---|---|---|---|
CECHAxx | COK-001 | - | CXD2964GB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | edepot ps3secrets |
CECHAxx | COK-001 | 1-871-868-12 | CXD2964AGB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | reballing.es |
CECHAxx | COK-001 | 1-871-868-22 | CXD2964GB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | reballing.es |
CECHAxx | COK-001 | 1-871-868-32 | CXD2964GB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | reballing.es |
CECHBxx | COK-001 | - | CXD2964GB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | edepot ps3secrets |
CECHBxx | COK-001 | 1-871-868-22 | CXD2964GB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | reballing.es |
CECHBxx | COK-001 | 1-871-868-32 | CXD2964GB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | reballing.es |
CECHCxx | COK-002 | 1-873-513-21 1-873-513-31 |
CXD2964GB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | edepot ps3secrets |
CECHExx | COK-002W | - | CXD29?? | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | edepot ps3secrets |
CECHExx | COK-002W | 1-873-513-21 | CXD2964GB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | reballing.es |
CECHExx | COK-002W | 1-873-513-21 | CXD2964AGB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | reballing.es |
CECHExx | COK-002W | 1-873-513-31 | CXD2964AGB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | reballing.es |
CECHExx | COK-002W | 1-873-513-31 | CXD2964GB | 90nm | 235.48mm² | 19.17mm x 12.29mm | 14.76mm² | 28.86mm² | reballing.es |
CECHGxx | SEM-001 | 1-875-384-11 1-875-384-21 1-875-384-31 |
CXD2981AGB | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | edepot ps3secrets |
CECHHxx | DIA-001 | 1-875-368-11 1-875-368-31 |
CXD2981GB | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | edepot ps3secrets |
CECHHxx | DIA-001 | 1-875-938-11 | CXD2981AGB | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | reballing.es |
CECHHxx | DIA-001 | 1-875-938-31 | CXD2981AGB | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | reballing.es |
CECHJxx | DIA-002 | 1-876-912-31 | CXD2989GB | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | edepot ps3secrets |
CECHKxx | DIA-002 | 1-876-912-32 | CXD2989AGB | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | edepot ps3secrets |
CECHKxx | DIA-002 | 1-876-912-32 | CXD2990GB | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | |
CECHLxx | VER-001 | - | CXD2990AGB | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | edepot ps3secrets |
CECHLxx | VER-001 | 1-878-196-31 | CXD2990GB | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | reballing.es |
CECHMxx | VER-001 | ?1-878-196-41? | -? | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | -? |
CECHPxx | VER-001 | 1-878-196-31 | CXD2990AGB | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | -? |
CECHQxx | VER-001 | ?1-878-196-41? | CXD299? | 65nm | 174.61mm² | 15.59mm x 11.20mm | 11.08mm² | 19.60mm² | edepot ps3secrets |
CECH-20xx | DYN-001 | - | CXD2992AGB | 45nm | 115.46mm² | 12.75mm x 9.06mm | 6.47mm² | 11.32mm² | edepot ps3secrets |
CECH-20xx | DYN-001 | 1-880-055-31 | CXD2992AGB | 45nm | 115.46mm² | 12.75mm x 9.06mm | 6.47mm² | 11.32mm² | reballing.es |
CECH-21xx | SUR-001 | - | CXD2992AGB | 45nm | 115.46mm² | 12.75mm x 9.06mm | 6.47mm² | 11.32mm² | edepot ps3secrets |
CECH-21xx | SUR-001 | 1-881-945-11 | CXD2992AGB | 45nm | 115.46mm² | 12.75mm x 9.06mm | 6.47mm² | 11.32mm² | reballing.es |
CECH-25xx | JTP-001 | 1-882-481-21 | CXD2992GB | 45nm | 115.46mm² | 12.75mm x 9.06mm | 6.47mm² | 11.32mm² | |
CECH-25xx | JTP-001 | 1-882-481-31 | CXD2992GB | 45nm | 115.46mm² | 12.75mm x 9.06mm | 6.47mm² | 11.32mm² | edepot ps3secrets |
CECH-25xx | JSD-001 | 1-882-770-11 | CXD2992BGB | 45nm | 115.46mm² | 12.75mm x 9.06mm | 6.47mm² | 11.32mm² | |
CECH-25xx | JSD-001 | 1-882-770-21 | CXD2992GB | 45nm | 115.46mm² | 12.75mm x 9.06mm | 6.47mm² | 11.32mm² | |
CECH-30xx | KTE-001 | 1-884-749-11 | CXD2996GB? | 45nm? | 115.46mm²? | 12.75mm x 9.06mm? | 6.47mm²? | 11.32mm²? | -? |
CECH-30xx | KTE-001 | 1-884-749-31 | CXD2996GB | 45nm | 115.46mm² | 12.75mm x 9.06mm | 6.47mm² | 11.32mm² | |
CECH-40xx | MSX-001 | 1-886-928-11 | CXD2996BGB | 45nm? | 115.46mm²? | 12.75mm x 9.06mm? | 6.47mm²? | 11.32mm²? | techrepublic |
CECH-40xx | MPX-001 | 1-887-233-11 | CXD2996BGB | 45nm? | 115.46mm²? | 12.75mm x 9.06mm? | 6.47mm²? | 11.32mm²? | -? |
? | NPX-001 | ? | ? | 45nm? | 115.46mm²? | 12.75mm x 9.06mm? | 6.47mm²? | 11.32mm²? | -? |
? | PPX-001 | ? | ? | ?nm (smaller ?) | ?mm² | ?mm x ?mm | ?mm² | ?mm² | |
CECH-42xx | PQX-001 | 1-888-629-22 | CXD2999AGG | ?nm (smaller ?) | ?mm² | ?mm x ?mm | ?mm² | ?mm² | mobile01_tw |
? | RTX-001 | ? | ? | ?nm (smaller ?) | ?mm² | ?mm x ?mm | ?mm² | ?mm² | |
CECH-43xx | REX-001 | 1-893-507-31 | CXD2999AGG | 45nm | 115.46mm² | 12.75mm x 9.06mm | ?mm² | ?mm² | Identical die size despite smaller case. Die (sometimes?) glued/soldered to IHS! Do not delid! |
Alternative list[edit | edit source]
- Template:CELL pad layout 90nm (41x41)-(19x19)-84 = 1681-361-84 = 1236 pads
- Template:CELL pad layout 65nm (41x41)-(15x17)-84 = 1681-255-84 = 1342 pads
- CXD2981 series
- CXD2981GB, found in: CECHHxx/DIA-001
- CXD2981AGB, found in: CECHHxx/DIA-001 and CECHGxx/SEM-001
- CXD2981BGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
- CXD2981CGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
- CXD2989 series
- CXD2990 series
- CXD2981 series
- Template:CELL pad layout 45nm v1 (41x41)-(17x17)-84 = 1681-289-84 = 1308 pads
- CXD2992 series
- CXD2992GB, found in: CECH-25xx/JTP-001 and CECH-25xx/JSD-001 (without the black plastic spacer in between the IHS and the substrate. Standard thermal paste in the DIE)
- CXD2992AGB, found in: CECH-20xx/DYN-001, CECH-21xx/SUR-001
- CXD2992BGB, found in: CECH-25xx/JTP-001 and CECH-25xx/JSD-001 (with the black plastic spacer in between the IHS and the substrate. Posible thermal adhesive in the DIE)
- CXD2992CGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
- CXD2996 series
- CXD2996GB, found in: CECH-30xx/KTE-001 and CECH-40xx/MSX-001
- CXD2996AGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
- CXD2996BGB, found in: CECH-30xx/KTE-001 and CECH-40xx/MPX-001 (with the black plastic spacer in between the IHS and the substrate. Posible thermal adhesive in the DIE)
- CXD2996CGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
- CXD2992 series
- Template:CELL pad layout 45nm v2 (42x42)-(22x18)-9 = 1764-396-9 = 1359 pads
- CXD2999 series (45 nm ?)
- CXD2999GG, never reported to wiki but google knows it, belongs to the same series with the suffix "GG" -> "AGG" -> "BGG"
- CXD2999AGG, found in: CECH-42xx/PQX-001
- CXD2999BGG, never reported to wiki but google knows it, belongs to the same series with the suffix "GG" -> "AGG" -> "BGG"
- CXD2999 series (45 nm ?)
PVR (powerpc version register)[edit | edit source]
The PVR inside the microprocessor is the only way to identify what version of what part you have.
cat /proc/cpuinfo
or
unsigned int pvr; __asm__ __volatile__ ("mfpvr %0" : "=r" (pvr));
code above should work in kernel & user mode.
CellBE serial | die tech | PVR | Notes |
---|---|---|---|
CXD2964AGB | 90nm | ||
CXD2964GB | 90nm | ||
CXD2981AGB | 65nm | ||
CXD2981GB | 65nm | ||
CXD2989AGB | 65nm | ||
CXD2989GB | 65nm | ||
CXD2990AGB | 65nm | ||
CXD2990GB | 65nm | ||
CXD2992AGB | 45nm | ||
CXD2992GB | 45nm | ||
CXD2996GB | 45nm | ||
CXD2999AGG |
Cell Revisions[edit | edit source]
Low word of BP_VR | Revision | Name |
---|---|---|
0x0000 | 0x010 | 90 nm DD 1.0 |
0x0001 | 0x011 | 90 nm DD 1.1 |
0x0002 | 0x012 | 90 nm DD 1.2 |
0x0100 | 0x020 | 90 nm DD 2.0 |
0x0200 | 0x030 | 90 nm DD 3.0 |
0x0201 | 0x031 | 90 nm DD 3.1 |
0x0202 | 0x032 | 90 nm DD 3.2 |
0x1000 | 0x110 | 65 nm DD 1.0 |
0x2000 | 0x210 | 45 nm DD 1.0 |
0x2100 | 0x220 | 45 nm DD 2.0 |
CellBE Version | PVR | Speed | SKU |
---|---|---|---|
Cell/BE v1.0 | 0x0070 0x0100 | 2.4GHz | CEB-1020 |
Cell/BE v2.0 | 0x0070 0x0400 | 2.4GHz | CEB-2030, CEB-2040 |
Cell/BE v3.0 | 0x0070 0x0500 | 3.2GHz | CEB-2050 |
Cell/BE v3.1 | 0x0070 0x0501 | 3.2GHz | CEB-9000 |
Cell/BE v3.2 | 0x0070 0x0501 | 3.2GHz | |
???? | 0x0070 0x2100 | ||
11S DD1.0 | ???? | ???? | VER-001 |
12S DD2.0 | ???? | ???? | KTE-001 |
Unsorted[edit | edit source]
Cell Integrated Heat Spreader (IHS) WARNING[edit | edit source]
Starting with PS3 Slim models CECH-25xx some of the CELL Integrated Heat Spreaders are secured to the CELL processor die with thermal adhesive. Cell processor models with a thinner substrate and black plastic spacer in between the IHS and the substrate may be glued. Removing an IHS that is glued to the Cell will destroy the Cell CPU.
Integrated Heat Spreader (IHS) removed pic's[edit | edit source]
- when it goes OK:
- when it goes wrong:
IHS size and mounting[edit | edit source]
on a COK-001 the CPU heatspreader is 4.00cm x 4.00cm while the RSX heatspreader is 4.25cm x 4.25 cm - CPU and RSX mountholes are 8.75cm apart and 6.3mm diameter
although a PC cooler should fit within these dimensions fine, mounting the 2 (which are also elevated differently from the motherboard) can be problematic
IHSBuster tool[edit | edit source]
|